Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4735-B20-GMR by Silicon Labs is a telecom IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. With a very thin profile, it's ideal for telecom circuit applications requiring surface mount technology.
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Surface mount technology allows for efficient and reliable PCB assembly, making this product easy to integrate into electronic devices.
The square package shape provides a compact design, saving valuable space on the PCB and allowing for more components to be placed in a limited area.
With 20 terminals, this product offers a sufficient number of connection points for complex telecom interface applications, improving versatility and functionality.
The high maximum operating temperature of 85°C ensures reliability and stability under harsh environmental conditions, making it suitable for a wide range of applications.
The low minimum operating temperature of -20°C allows for the product to operate in cold environments without performance degradation, increasing its suitability for various settings.
The quad terminal position offers improved connectivity and ease of soldering, enhancing the overall reliability and performance of the product.
The low maximum seated height of 0.6 mm enables a compact overall design of the product, contributing to space-saving and efficient PCB layout.
The small width of 3 mm allows for a narrow footprint on the PCB, facilitating denser component placement and enhancing overall design flexibility.
The short length of 3 mm further contributes to the compact form factor of the product, making it suitable for applications with limited space constraints.
The no-lead terminal form eliminates the need for traditional soldering of leads, reducing assembly complexity and potential soldering issues, leading to a more reliable end product.
Being specifically designed for telecom circuit applications, this product ensures optimized performance, compatibility, and reliability in telecommunications systems.
The fine terminal pitch of 0.5 mm allows for high-density mounting on the PCB, enabling more terminals to be accommodated within a limited space, enhancing design efficiency and functionality.
Other Function Telecom Interface ICs SI4735-B20-GMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SI4735-B20-GMR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - PCN-1105171 17/May/2011
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
ABS06-32.768KHZ-T
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Onsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Formosa Microsemi
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
Changzhou Starsea Electronics
Taitron Components
Taiwan Semiconductor
NINA-B112-05B
U-blox Ag
TELECOM CIRCUIT;
MAX7033EUI+
Analog Devices
MAX7033EUI+ by Analog Devices is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and uses CMOS technology. This IC is ideal for telecom circuits in industrial applications due to its small outline package and dual terminal position.
ZED-F9H-01B
CC1175RHBR
CC1175RHBR by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5/3.3V and data rate of 0.2 Mbps, suitable for industrial applications requiring a compact chip carrier package with surface mount capability.
ISL32275EFVZ-T
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
BT851
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
SA616DK/01,118
NXP Semiconductors
SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.
CC2640F128RSMT
CC2640F128RSMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.4mm and no-lead terminal form for industrial applications.
SAM-M8Q
USB3740B-AI9-TR
Microchip Technology
USB3740B-AI9-TR by Microchip is a telecom IC with 10 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is ideal for telecom circuit applications.
SIM900
Simcom Wireless Solutions
SIM900 by Simcom Wireless Solutions is a telecom IC with 0.0856 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has 68 terminals in a square package. Ideal for telecom applications requiring high-speed data transmission.
MGC3030-I/SS
MGC3030-I/SS by Microchip is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package, matte tin finish, and nominal voltage of 3.3V. Ideal for telecom circuits, it features gull wing terminals and is suitable for industrial temperature grades.
TDK5100FHTMA1
Infineon's TDK5100FHTMA1 is a telecom IC with 10 terminals, operating from -40 to 125°C. Its small outline package is surface-mountable and has a matte tin finish. Ideal for automotive applications, this IC operates at 3V and features a square shape with a 3x3mm footprint.
ODIN-W260
ODIN-W260 by U-blox Ag is a TELECOM CIRCUIT with 3.3V supply, operating from -40°C to 85°C. RECTANGULAR MICROELECTRONIC ASSEMBLY package for telecom interfaces, ideal for various applications requiring reliable connectivity in extreme temperature conditions.
SJA1105TELY
The NXP SJA1105TELY is a telecom interface IC with 159 terminals in a grid array package. It operates b/w -40°C to 105°C, supporting data rates up to 100 Mbps. Designed for telecom circuits, it has a low profile and fine pitch, making it suitable for various applications.
RN4870-I/RM128
RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.
EFR32BG22C222F352GM40-C
Silicon Labs
TELECOM CIRCUIT; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
ODIN-W260-04B-00
Other Telecom ICs; Moisture Sensitivity Level (MSL): 4;
453-00039R
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
HMC1094LP3ETR
Analog Devices' HMC1094LP3ETR is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 3.3V and matte tin terminal finish, ideal for telecom circuit applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SI4732-A10-GS
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
SI4744-C10-GMR
Skyworks Solutions
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
SI4744-C10-GMR by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 24 terminals, and a max operating temperature of 85°C. This IC is suitable for telecom circuit applications in industrial settings.
SI4777-A20-GMR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
SI4732-A10-GSR
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
SI4736
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
SI4737
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;
SI4735
SI4730-B20-GM
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4731-B20-GMR
SI4734-B20-GMR
SI4735-B20-GM
SI4738-B20-GM
SI4739-B20-GMR
SI4737-C40-GMR
SI4737-C40-GM
SI4738-C40-GMR
SI4738-C40-GM
SI4739-C40-GM
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