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AD61009ARSRL

Analog Devices

AD61009ARSRL by Analog Devices

AD61009ARSRL by Analog Devices is a telecom IC with 20 terminals in a small outline package. It operates b/w -25 °C to 85°C, with a nominal voltage of 3V. This Gull Wing terminal IC is ideal for telecom circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,641 parts In-Stock

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Digiode

USA . 881 parts In-Stock

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881

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Distributors (Availability)

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Native Components

USA . 306 parts In-Stock

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$0.932

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306

$0.932

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Northwest PG Solutions

USA . 797 parts In-Stock

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$1.025

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797

$1.025

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Parana Technologies

USA . 3,637 parts In-Stock

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$6.972

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$6.484

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3,637

$6.972

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$6.484

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IDEA Electronic Components Group

UK . 798 parts In-Stock

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$7.497

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$7.122

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798

$7.497

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$7.122

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AZTECH Wire

Italy . 487 parts In-Stock

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$11.187

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487

$11.187

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DigiPath Technology Company

USA . 1,119 parts In-Stock

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$11.695

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$11.228

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$11.228

1,119

$11.695

$11.228

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$11.228

Ampacity Inc.

Singapore . 303 parts In-Stock

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$662.000

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$662.000

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One Stop Electronics

USA . 815 parts In-Stock

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$772.000

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815

$772.000

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Semicontronic

India . 319 parts In-Stock

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$959.000

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$935.025

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$930.230

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319

$959.000

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Corphita

USA . 376 parts In-Stock

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Overview

Upgrade your telecom interface with the AD61009ARSRL from Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-quality products that exceed expectations. This versatile telecom IC is perfect for a variety of applications, offering reliable performance and seamless integration. With its small outline package and dual terminal position, this product is designed for efficiency and ease of use. Experience the value and benefits of the AD61009ARSRL, providing customers with a superior solution to their telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of PCB space.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in that field.

Nominal Supply Voltage: 3 V

Operates at a low nominal supply voltage, making it energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs AD61009ARSRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

AD61009ARSRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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