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AD6122ACPRL

Analog Devices

AD6122ACPRL by Analog Devices

AD6122ACPRL by Analog Devices is a BICMOS technology IC with 32 terminals, operating at -40 to 85 °C. It has a 3V supply voltage and is used in telecom circuits due to its compact square package style and surface mount capability.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,828 parts In-Stock

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Digiode

USA . 259 parts In-Stock

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AZTECH Wire

Italy . 468 parts In-Stock

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$10.222

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Parana Technologies

USA . 416 parts In-Stock

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$16.611

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$15.448

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

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$17.861

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$16.968

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DigiPath Technology Company

USA . 296 parts In-Stock

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$27.863

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$26.749

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One Stop Electronics

USA . 513 parts In-Stock

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$464.000

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Ampacity Inc.

Singapore . 1,294 parts In-Stock

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Semicontronic

India . 326 parts In-Stock

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$927.000

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$903.825

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$899.190

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Northwest PG Solutions

USA . 1,731 parts In-Stock

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Native Components

USA . 594 parts In-Stock

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Corphita

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Overview

Enhance your telecom systems with the AD6122ACPRL from Analog Devices, a leading manufacturer known for top-quality products. This versatile telecom interface IC boasts a range of applications and benefits, providing customers with value and reliability. With its innovative technology and industrial-grade design, this chip carrier offers high performance in a compact package. Upgrade your telecom solutions today with the AD6122ACPRL and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal properties, ensuring the product's reliability in various operating conditions.

Surface Mount: YES

The surface mount feature makes the installation of the product easier and more convenient, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates a compact design for the overall system.

Power Supplies (V): 3

Operating at a low voltage of 3V makes this product energy efficient and suitable for power-sensitive applications.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and functionalities within the product, increasing its versatility and usability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design provides efficient heat dissipation and space-saving advantages for the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand rigorous environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at a minimum temperature of -40 °C ensures reliable performance in cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances the product's solderability and ensures stable electrical connections for optimal performance.

Terminal Position: QUAD

The quad terminal position enables efficient routing of signals and power within the product, enhancing its functionality and performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact and low-profile design, making the product suitable for space-constrained applications.

Width: 5 mm

The product's compact width of 5mm enables easy integration into various system designs and layouts.

Length: 5 mm

With a length of 5mm, the product offers a balanced form factor that can fit in various system configurations without compromising functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the necessary temperature requirements and operational standards for industrial use cases.

Technology: BICMOS

Utilizing BiCMOS technology ensures a combination of bipolar and CMOS advantages, such as high-speed operation and low power consumption, making the product efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of lead contamination and complies with environmental regulations, making the product environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, this product is specialized for telecommunications applications, providing reliable communication functionalities and performance.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources and enhances the product's energy efficiency.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise and compact terminal spacing, optimizing signal integrity and board space utilization in the product.

Technical Specifications

Other Function Telecom Interface ICs AD6122ACPRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AD6122ACPRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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