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AD6121ACPRL

Analog Devices

AD6121ACPRL by Analog Devices

AD6121ACPRL by Analog Devices is a 32-terminal BICMOS telecom IC with 3V supply voltage. It operates b/w -40 to 85 °C and comes in a square chip carrier package style. Ideal for telecom circuits, it features tin-lead terminal finish and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,306 parts In-Stock

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Digiode

USA . 637 parts In-Stock

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637

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Distributors (Availability)

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Parana Technologies

USA . 1,344 parts In-Stock

1+ parts

$15.205

100+ parts

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$14.140

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1,344

$15.205

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$14.140

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IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$16.349

100+ parts

$15.532

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$15.532

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997

$16.349

$15.532

$15.532

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AZTECH Wire

Italy . 614 parts In-Stock

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$19.258

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614

$19.258

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DigiPath Technology Company

USA . 2,967 parts In-Stock

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$25.504

100+ parts

$24.484

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$24.484

2,967

$25.504

$24.484

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$24.484

Native Components

USA . 636 parts In-Stock

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$26.955

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636

$26.955

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Northwest PG Solutions

USA . 779 parts In-Stock

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$29.651

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$26.686

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779

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$26.686

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Semicontronic

India . 240 parts In-Stock

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$66.000

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$64.350

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$64.020

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240

$66.000

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$64.020

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Ampacity Inc.

Singapore . 1,378 parts In-Stock

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$522.000

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$522.000

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One Stop Electronics

USA . 1,017 parts In-Stock

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$896.000

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$896.000

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Corphita

USA . 758 parts In-Stock

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Overview

Enhance your telecommunications projects with the AD6121ACPRL from Analog Devices, a leading manufacturer known for its top-quality products. This versatile telecom interface IC is perfect for a wide range of applications, offering reliability and performance that exceeds expectations. With its innovative design and advanced technology, this product provides unmatched value and benefits to customers seeking seamless connectivity solutions. Upgrade your projects today with the AD6121ACPRL and experience the advantages of superior engineering and functionality.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides stability and uniformity in design, making it easier to integrate into various systems.

Power Supplies (V): 3

Operates at a standard voltage of 3V, making it compatible with a wide range of applications.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting to multiple components, enhancing versatility in connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85 °C, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Can function in extremely cold temperatures as low as -40 °C, providing versatility in temperature range.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures a reliable and durable connection, enhancing overall performance and longevity.

Terminal Position: QUAD

Quad terminal position allows for easy installation and secure connection, improving stability and reliability.

Maximum Seated Height: 1 mm

Low seated height of 1mm enables compact design and space-saving installation.

Width: 5 mm

Narrow width of 5mm facilitates integration into tight spaces and compact electronic devices.

Length: 5 mm

Short length of 5mm contributes to a small footprint and efficient use of space in electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance under varying temperature conditions typically found in industrial environments.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of high-speed CMOS logic and low-power bipolar technology, delivering optimal performance and efficiency.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead-related issues, such as solder fatigue, making it environmentally friendly and safe for use.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring compatibility and performance in telecommunication systems.

Nominal Supply Voltage: 3 V

Matches the nominal supply voltage of 3V, ensuring seamless integration and reliable operation within the specified voltage range.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging, allowing for more compact and efficient circuit designs.

Technical Specifications

Other Function Telecom Interface ICs AD6121ACPRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AD6121ACPRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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