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AD6121ARSRL

Analog Devices

AD6121ARSRL by Analog Devices

AD6121ARSRL by Analog Devices is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage of 3V, it is designed for telecom circuit interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,241 parts In-Stock

1+ parts

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8,241

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Digiode

USA . 529 parts In-Stock

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529

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 605 parts In-Stock

1+ parts

$5.003

100+ parts

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605

$5.003

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Parana Technologies

USA . 3,725 parts In-Stock

1+ parts

$13.999

100+ parts

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$13.019

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3,725

$13.999

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$13.019

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

1+ parts

$15.053

100+ parts

$14.300

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$14.300

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2,212

$15.053

$14.300

$14.300

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DigiPath Technology Company

USA . 3,725 parts In-Stock

1+ parts

$23.483

100+ parts

$22.543

1k+ parts

-

10k+ parts

$22.543

3,725

$23.483

$22.543

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$22.543

Native Components

USA . 527 parts In-Stock

1+ parts

$25.324

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527

$25.324

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Northwest PG Solutions

USA . 741 parts In-Stock

1+ parts

$27.857

100+ parts

$25.071

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741

$27.857

$25.071

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One Stop Electronics

USA . 669 parts In-Stock

1+ parts

$783.000

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669

$783.000

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Semicontronic

India . 1,444 parts In-Stock

1+ parts

$996.000

100+ parts

$971.100

1k+ parts

$966.120

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1,444

$996.000

$971.100

$966.120

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Corphita

USA . 967 parts In-Stock

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967

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Overview

Enhance your telecom systems with the AD6121ARSRL by Analog Devices, a top-quality manufacturer known for their innovative solutions. This versatile telecom interface IC offers exceptional reliability and performance, making it ideal for a wide range of applications. Upgrade your communication systems with ease, thanks to its user-friendly design and advanced technology. Experience seamless integration and improved functionality with this superior product, providing unmatched value and benefits to customers looking to elevate their telecom capabilities. Elevate your telecom experience with Analog Devices today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in telecom interface ICs as it provides efficient use of space and allows for easy handling during assembly.

Power Supplies (V): 3

Operating at 3 volts makes this product compatible with a wide range of power sources and ensures efficient power consumption.

No. of Terminals: 28

Having a larger number of terminals allows for more functionality and connectivity options, making this product versatile in various telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding industrial conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type ensures optimal performance and reliability in telecommunications systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 volts ensures compatibility with standard power sources and efficient power consumption.

Technical Specifications

Other Function Telecom Interface ICs AD6121ARSRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XDSO-G28

JESD-609 Code:

e0

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.98 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

AD6121ARSRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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