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TCP-4182UB-DT

Onsemi

TCP-4182UB-DT by Onsemi

TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

24,000

-

$0.291

$0.241

$0.215

Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

16,000

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,028 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,028

$0.226

-

-

-

Vyrian

USA . 8,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,959

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,349 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

1,349

$0.214

-

-

-

Corohmni

South Africa . 373 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$0.238

-

-

-

AZTECH Wire

Italy . 1,164 parts In-Stock

1+ parts

$15.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$15.700

-

-

-

Continental Prestige Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.210

10k+ parts

-

24,000

-

-

$0.210

-

Problanco Electronics

Mexico . 8,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,326

-

-

-

-

Kulean Microsystems

USA . 7,943 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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7,943

-

-

-

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Kepictronics

USA . 7,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,270

-

-

-

-

SupplyDigital Components

Austria . 3,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,333

-

-

-

-

TANS Electronics

Latvia . 2,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,641

-

-

-

-

UHIMA Technologies

Türkiye . 503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

503

-

-

-

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Formix International (Excess)

India . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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290

-

-

-

-

Overview

Experience seamless connectivity with the TCP-4182UB-DT by Onsemi, a cutting-edge Other Function Telecom Interface IC that guarantees top-notch quality and reliability. Onsemi is renowned for its innovative solutions in the telecom industry, making this product a must-have for various applications. Enjoy the benefits of high performance and efficiency, thanks to its advanced features and superior design. Elevate your projects with the TCP-4182UB-DT and unlock endless possibilities in telecommunications technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, ensuring reliability in a variety of operating conditions.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape is commonly used for telecom interface ICs, making it compatible with standard mounting and design practices.

No. of Terminals: 4

Having 4 terminals allows for efficient connectivity within the circuit, enabling proper communication and functionality.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style maximizes space utilization, making it ideal for compact telecom devices with limited board space.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably even in high temperature environments.

Minimum Operating Temperature: -30 °C

The ability to operate at a minimum temperature of -30 °C makes this IC suitable for use in various environmental conditions.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

Having the terminals at the bottom ensures secure soldering connections and efficient signal transmission within the circuit.

Maximum Seated Height: 0.345 mm

The low maximum seated height allows for a slim and compact design, making it suitable for thin telecom devices or applications with space constraints.

Width: 0.609 mm

The narrow width enables the IC to fit comfortably on circuit boards without taking up excessive space, facilitating a clean and organized layout.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering and assembly during manufacturing, leading to robust connections.

Length: 1.009 mm

The compact length allows for efficient placement on the circuit board, contributing to a streamlined and space-saving design.

Terminal Form: BALL

The ball terminal form offers secure connections and facilitates efficient soldering, ensuring reliable performance and signal integrity.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC is optimized for telecom communication protocols and requirements, ensuring seamless compatibility and performance.

Terminal Pitch: 0.42 mm

The small terminal pitch of 0.42 mm allows for precise and compact placement of the IC on the PCB, enhancing signal integrity and overall performance.

Technical Specifications

Other Function Telecom Interface ICs TCP-4182UB-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

1.009 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4182UB-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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