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TCP-4133UA-DT

Onsemi

TCP-4133UA-DT by Onsemi

TCP-4133UA-DT by Onsemi is a telecom interface IC with 4 terminals in a grid array package. It operates b/w -30 to 85 °C, with terminal finish of nickel gold. Its thin profile and fine pitch make it suitable for telecom circuit applications.

Median Price

$0.302

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 492,000 parts In-Stock

1+ parts

-

100+ parts

$0.302

1k+ parts

$0.251

10k+ parts

$0.224

492,000

-

$0.302

$0.251

$0.224

DigiKey

USA . 492,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.380

10k+ parts

-

492,000

-

-

$0.380

-

Verical

USA . 490,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.280

490,000

-

-

-

$0.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,666 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

$0.202

-

-

-

Digiode

USA . 303 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

-

303

$0.236

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 465 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$0.202

-

-

-

Corphita

USA . 82 parts In-Stock

1+ parts

$0.223

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$0.223

-

-

-

Continental Prestige Electronics

USA . 492,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.202

10k+ parts

-

492,000

-

-

$0.202

-

TANS Electronics

Latvia . 6,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,929

-

-

-

-

Problanco Electronics

Mexico . 5,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,283

-

-

-

-

SupplyDigital Components

Austria . 1,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,304

-

-

-

-

Kulean Microsystems

USA . 1,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,153

-

-

-

-

Kepictronics

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

UHIMA Technologies

Türkiye . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Overview

Enhance your telecommunication systems with the TCP-4133UA-DT by Onsemi, a top-quality telecom interface IC that promises reliability and seamless performance. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled value and benefits to customers looking to optimize their communication networks. Perfect for a variety of applications, this innovative IC boasts a sleek design and superior functionality, making it an essential component for any telecom setup. Upgrade your systems today with the TCP-4133UA-DT and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy and efficient installation on a printed circuit board, saving time and resources during assembly.

Package Shape: RECTANGULAR

Enables a compact and space-efficient design, ideal for devices where size is a key factor.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the IC can be used in various environments without risk of overheating.

Terminal Finish: NICKEL GOLD

Provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the IC.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in communication systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-4133UA-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.862 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4133UA-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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