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TCP-4127UB-DT

Onsemi

TCP-4127UB-DT by Onsemi

TCP-4127UB-DT by Onsemi is a Telecom IC with 4 terminals, operating temp range of -30 to 85 °C. It features a very thin profile, fine pitch package style suitable for telecom circuit applications. The package body material is plastic/epoxy with nickel gold terminal finish, making it ideal for surface mount assembly.

Median Price

$0.269

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

6,050

-

$0.291

$0.241

$0.215

DigiKey

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

6,050

-

-

-

$0.250

Verical

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

6,050

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 458 parts In-Stock

1+ parts

$0.226

100+ parts

-

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458

$0.226

-

-

-

Vyrian

USA . 1,141 parts In-Stock

1+ parts

$0.238

100+ parts

-

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1,141

$0.238

-

-

-

Bristol Electronics

USA . 3,273 parts In-Stock

1+ parts

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3,273

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Dan-Mar Components

USA . 3,273 parts In-Stock

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3,273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,264 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

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10k+ parts

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2,264

$0.214

-

-

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Corohmni

South Africa . 153 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

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10k+ parts

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153

$0.238

-

-

-

Perfect Parts

USA . 28,000 parts In-Stock

1+ parts

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100+ parts

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28,000

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-

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Kulean Microsystems

USA . 8,357 parts In-Stock

1+ parts

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8,357

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Problanco Electronics

Mexico . 6,184 parts In-Stock

1+ parts

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6,184

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SupplyDigital Components

Austria . 6,115 parts In-Stock

1+ parts

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100+ parts

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6,115

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Continental Prestige Electronics

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.172

10k+ parts

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6,050

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-

$0.172

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

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4,500

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TANS Electronics

Latvia . 889 parts In-Stock

1+ parts

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889

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UHIMA Technologies

Türkiye . 410 parts In-Stock

1+ parts

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100+ parts

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410

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-

Overview

Enhance your telecommunication systems with the TCP-4127UB-DT by Onsemi. Manufactured by a trusted industry leader, this telecom interface IC offers unparalleled quality and reliability. Ideal for a range of applications, this product provides seamless connectivity and communication solutions. With its cutting-edge technology and durable design, customers can trust in the value and benefits that this product brings to their projects. Upgrade your systems today with the TCP-4127UB-DT and experience the advantages of advanced telecom circuitry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various operating conditions, making this product suitable for long-term use.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 4

Having 4 terminals provides sufficient connection points for different functions, enabling versatile usage in telecom interfaces.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can reliably function in various environmental conditions without overheating.

Width: 0.609 mm

Narrow width of 0.609 mm allows for compact design and efficient use of space on circuit boards, especially in densely populated layouts.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product is optimized for telecom interfaces, ensuring compatibility and performance in communication systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-4127UB-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.626 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4127UB-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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