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TCP-4118UB-DT

Onsemi

TCP-4118UB-DT by Onsemi

TCP-4118UB-DT by Onsemi is a Telecom IC with 4 terminals, operating temp range of -30 to 85 °C. It features a very thin profile package style and nickel gold terminal finish. Ideal for telecom circuit applications requiring fine pitch grid array packages.

Median Price

$0.269

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

16,000

-

$0.291

$0.241

$0.215

DigiKey

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

16,000

-

-

-

$0.250

Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

16,000

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,046 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,046

$0.226

-

-

-

Vyrian

USA . 1,392 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

$0.238

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,369 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

$0.214

-

-

-

Corohmni

South Africa . 328 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

328

$0.238

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,694 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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21,694

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-

-

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Continental Prestige Electronics

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.210

10k+ parts

-

16,000

-

-

$0.210

-

Problanco Electronics

Mexico . 6,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,456

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-

-

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SupplyDigital Components

Austria . 5,778 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,778

-

-

-

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Kulean Microsystems

USA . 4,744 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,744

-

-

-

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,500

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-

-

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Metaverse IC Inc.

Canada . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,000

-

-

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TANS Electronics

Latvia . 3,229 parts In-Stock

1+ parts

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100+ parts

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3,229

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-

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

-

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UHIMA Technologies

Türkiye . 63 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

-

10k+ parts

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63

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-

-

Overview

Enhance your telecom interface with the TCP-4118UB-DT by Onsemi, a top-tier manufacturer known for quality and innovation. This versatile product falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications. With a package body made of durable plastic/epoxy and a surface mount design, this device ensures reliability and ease of installation. Experience the benefits of its high performance and efficiency, making it an ideal choice for various telecom circuits. Upgrade your system with Onsemi's TCP-4118UB-DT and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal and electrical insulation, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for compact and space-saving design, ideal for modern telecom devices.

Package Shape: RECTANGULAR

Rectangular shape offers easy integration and alignment within telecom devices.

No. of Terminals: 4

Having 4 terminals allows for proper connectivity and signal transmission in telecom applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly for efficient installation.

Width: 0.609 mm

Narrow width enables space-efficient placement on the PCB, making it suitable for compact telecom devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust soldering connections for long-term reliability.

Terminal Form: BALL

Ball terminal form allows for reliable solder joints and good electrical connections during use.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, ensuring optimized performance in communication devices.

Terminal Pitch: 0.42 mm

Fine terminal pitch ensures high-density mounting and enhanced functionality in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs TCP-4118UB-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.626 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4118UB-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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