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TCP-4147UB-DT

Onsemi

TCP-4147UB-DT by Onsemi

TCP-4147UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C and has a peak reflow temp of 260 °C. Ideal for telecom circuit applications due to its fine pitch and ball terminal form.

Median Price

$0.269

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38,900 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

38,900

-

$0.291

$0.241

$0.215

DigiKey

USA . 38,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

38,900

-

-

-

$0.250

Verical

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

32,000

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,298 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

$0.226

-

-

-

Vyrian

USA . 884 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$0.238

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,150 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

2,150

$0.214

-

-

-

Corohmni

South Africa . 423 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$0.238

-

-

-

Continental Prestige Electronics

USA . 38,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.210

10k+ parts

-

38,900

-

-

$0.210

-

RC Electronics

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,900

-

-

-

-

Kepictronics

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,200

-

-

-

-

SupplyDigital Components

Austria . 3,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,100

-

-

-

-

TANS Electronics

Latvia . 2,815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,815

-

-

-

-

Problanco Electronics

Mexico . 2,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,548

-

-

-

-

Kulean Microsystems

USA . 876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

876

-

-

-

-

UHIMA Technologies

Türkiye . 823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

823

-

-

-

-

Formix International (Excess)

India . 178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

178

-

-

-

-

Overview

Elevate your telecom interface experience with the TCP-4147UB-DT by Onsemi. Known for their top-notch quality and cutting-edge technology, Onsemi delivers reliable products that exceed expectations. This versatile IC is perfect for various applications in the telecom industry, providing seamless connectivity and optimal performance. With a sleek design and advanced features, this product offers unmatched value and benefits to customers. Upgrade your telecom systems today with the TCP-4147UB-DT and experience the difference Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for applications where weight and durability are important.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration and mounting on the PCB, maximizing space efficiency.

No. of Terminals: 4

Having 4 terminals allows for necessary connections and functionality in the telecom interface IC.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density integration, optimal signal performance, and efficient space utilization on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures that the product can operate in cold environments without any issues.

Terminal Finish: NICKEL GOLD

Nickel gold finish provides excellent corrosion resistance and ensures long-term reliability of the terminals.

Terminal Position: BOTTOM

Bottom terminal position facilitates PCB layout and connection, ensuring easy integration into the system.

Maximum Seated Height: 0.345 mm

Low seated height allows for compact design and easy installation in space-constrained applications.

Width: 0.609 mm

Narrow width enables high-density mounting on the PCB, saving valuable space and enhancing overall system performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reworkability during PCB assembly processes.

Length: 0.964 mm

Compact length contributes to the overall small footprint of the product, enabling efficient use of space on the PCB.

Terminal Form: BALL

Ball terminal form provides secure electrical connections and enables high-speed signal transmission in the IC.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and reliability in communication systems.

Terminal Pitch: 0.42 mm

Fine terminal pitch allows for high-density mounting, precise connections, and efficient signal transmission in the IC.

Technical Specifications

Other Function Telecom Interface ICs TCP-4147UB-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.964 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4147UB-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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