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TCP-4139UB-DT

Onsemi

TCP-4139UB-DT by Onsemi

TCP-4139UB-DT by Onsemi is a telecom IC with 4 terminals, operating temp range of -30 to 85 °C. It features a grid array package style with very thin profile and fine pitch. Ideal for telecom circuit applications due to its nickel gold terminal finish and compact dimensions (0.862mm x 0.609mm x 0.345mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,228 parts In-Stock

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2,228

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Digiode

USA . 661 parts In-Stock

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661

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Distributors (Availability)

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Kulean Microsystems

USA . 8,095 parts In-Stock

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8,095

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SupplyDigital Components

Austria . 5,701 parts In-Stock

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5,701

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Problanco Electronics

Mexico . 5,162 parts In-Stock

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5,162

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Corphita

USA . 1,856 parts In-Stock

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1,856

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TANS Electronics

Latvia . 1,333 parts In-Stock

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1,333

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UHIMA Technologies

Türkiye . 675 parts In-Stock

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675

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Corohmni

South Africa . 299 parts In-Stock

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299

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Overview

Discover the power of seamless connectivity with the TCP-4139UB-DT by Onsemi. As a trusted manufacturer in the industry, Onsemi brings you a top-quality product that is perfect for various applications in the telecom sector. With its innovative design and reliable performance, this product offers unparalleled value and benefits to customers looking for efficient solutions. Experience the advantages of this Telecom Interface IC and elevate your communication systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used for electronic packaging due to its durability and thermal properties, ensuring the product is reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, making the product suitable for mass production.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space on the PCB and allowing for more efficient use of board real estate.

No. of Terminals: 4

Having a limited number of terminals simplifies the design and reduces the chances of errors during installation, making the product user-friendly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability under diverse environmental conditions, making the product suitable for a wide range of applications.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in cold environments without compromising performance, increasing its versatility.

Terminal Finish: NICKEL GOLD

Nickel gold finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time and enhancing the product's durability.

Terminal Position: BOTTOM

Bottom terminal position aids in efficient heat dissipation and allows for better PCB layout, contributing to the product's overall performance and reliability.

Maximum Seated Height: 0.345 mm

Low maximum seated height enables a slim and compact design, making the product suitable for applications where space is limited.

Width: 0.609 mm

Narrow width facilitates a smaller footprint on the PCB, allowing for more components to be integrated in a limited space, enhancing the overall functionality of the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering during assembly, preventing joint failure and ensuring the product's reliability under thermal stress.

Length: 0.862 mm

Short length contributes to a compact form factor, saving space on the PCB and enabling the product to be used in applications with tight dimensional constraints.

Terminal Form: BALL

Ball terminal form provides a reliable connection and facilitates soldering, ensuring secure attachment to the PCB and enhancing the product's performance.

Telecom IC Type: TELECOM CIRCUIT

Telecom circuit type indicates that the IC is specifically designed for telecom applications, ensuring compatibility and optimized performance in telecommunications systems.

Terminal Pitch: 0.42 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling more functionalities to be packed in a limited space and increasing the product's versatility.

Technical Specifications

Other Function Telecom Interface ICs TCP-4139UB-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.862 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4139UB-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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