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TCP-4127UA-DT

Onsemi

TCP-4127UA-DT by Onsemi

TCP-4127UA-DT by Onsemi is a telecom IC with 4 terminals, operating temp range of -30 to 85 °C. It features a grid array package style with very thin profile and fine pitch. Ideal for telecom circuit applications requiring surface mount technology in compact spaces.

Median Price

$0.288

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 52,000 parts In-Stock

1+ parts

-

100+ parts

$0.288

1k+ parts

$0.239

10k+ parts

$0.213

52,000

-

$0.288

$0.239

$0.213

DigiKey

USA . 52,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.360

10k+ parts

-

52,000

-

-

$0.360

-

Verical

USA . 52,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.266

52,000

-

-

-

$0.266

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,245 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$0.194

-

-

-

Digiode

USA . 823 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

-

10k+ parts

-

823

$0.224

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$0.194

-

-

-

Corphita

USA . 2,076 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,076

$0.212

-

-

-

Continental Prestige Electronics

USA . 52,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.194

10k+ parts

-

52,000

-

-

$0.194

-

RC Electronics

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,500

-

-

-

-

Kulean Microsystems

USA . 8,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,382

-

-

-

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TANS Electronics

Latvia . 6,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,724

-

-

-

-

Problanco Electronics

Mexico . 4,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,720

-

-

-

-

Kepictronics

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,400

-

-

-

-

SupplyDigital Components

Austria . 3,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,684

-

-

-

-

UHIMA Technologies

Türkiye . 524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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524

-

-

-

-

Overview

Unlock seamless communication with the TCP-4127UA-DT by Onsemi, a cutting-edge telecom interface IC designed to elevate your connectivity experience. Crafted by the renowned manufacturer Onsemi, this product boasts top-notch quality and reliability. Perfect for various applications in the telecom industry, this innovative IC offers unparalleled value, benefits, and advantages to customers. Say goodbye to connectivity issues and hello to superior performance with the TCP-4127UA-DT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Being surface mountable allows for easier integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and align during installation, reducing the risk of errors.

No. of Terminals: 4

With a moderate number of terminals, this IC is suitable for a variety of telecom interface applications without being overly complex.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch allows for high density mounting, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding telecom environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions, increasing versatility.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish offers excellent conductivity and corrosion resistance, maintaining signal integrity over time.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies soldering and connection processes, making installation easier for manufacturers.

Maximum Seated Height: 0.345 mm

The low maximum seated height allows for a slim profile, ideal for space-constrained applications.

Width: 0.609 mm

The compact width of the IC enables efficient use of board space, important for densely populated circuit boards.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly processes, ensuring a strong connection.

Length: 0.862 mm

The moderate length of the IC makes it suitable for various telecom interface applications without taking up excessive space.

Terminal Form: BALL

The ball terminal form offers a reliable connection and facilitates proper alignment during installation.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers optimized performance and functionality in telecommunications systems.

Terminal Pitch: 0.42 mm

The small terminal pitch allows for high-density mounting, enabling more terminals in a compact space for increased functionality.

Technical Specifications

Other Function Telecom Interface ICs TCP-4127UA-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e4

Length:

.862 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.345 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.42 mm

Terminal Position:

BOTTOM

Width:

.609 mm

Trade Compliance

TCP-4127UA-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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