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PN5120A0ET/C2EL

NXP Semiconductors

PN5120A0ET/C2EL by NXP Semiconductors

PN5120A0ET/C2EL by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3/3.3V with a max current of 100mA and supports temperatures from -30 °C to 85 °C. Ideal for compact, high-performance electronic devices.

Median Price

$5.657

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,800 parts In-Stock

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$5.657

9,800

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$5.657

Distributors (In-Stock)

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Vyrian

USA . 2,740 parts In-Stock

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2,740

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Digiode

USA . 2,417 parts In-Stock

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2,417

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Anansix

USA . 1,644 parts In-Stock

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1,644

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Distributors (Availability)

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AZTECH Wire

Italy . 52 parts In-Stock

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$12.940

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52

$12.940

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.717

100+ parts

$16.122

1k+ parts

$14.528

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1,000

$17.717

$16.122

$14.528

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One Stop Electronics

USA . 1,359 parts In-Stock

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$600.000

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1,359

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UNI Independent Distributors

Spain . 6,037 parts In-Stock

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6,037

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Corphita

USA . 2,290 parts In-Stock

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Overview

Unlock seamless connectivity with the PN5120A0ET/C2EL from NXP Semiconductors, a leader in innovative technology. This telecom interface IC offers exceptional reliability and performance across diverse applications, from industrial automation to smart home devices. Its compact design ensures easy integration while maintaining robust operation in challenging environments. Trust in NXP’s legacy for quality and elevate your projects with a solution that drives efficiency and enhances user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the IC reliable for various telecom applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on printed circuit boards, enabling compact designs that are essential in modern electronic devices.

Package Shape: SQUARE

The square shape contributes to better thermal performance and easier alignment during assembly, improving overall product efficiency.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, allowing easy integration into existing circuits without the need for additional components.

No. of Terminals: 64

A high number of terminals supports complex functionalities and increased interconnectivity, making it suitable for advanced telecom applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array design enhances performance by allowing for higher density connections, which is critical for modern telecommunications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in demanding environments, enhancing the product's longevity and performance.

Minimum Operating Temperature: -30 °C

This wide temperature range ensures functionality in extreme conditions, making it ideal for outdoor and industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal dissipation and simplifies the PCB layout, contributing to improved device performance.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates compatibility with lead-free solder processes, aligning with industry standards for environmental safety.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and support high-frequency signals, essential for effective communication in telecom devices.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA ensures that the IC can deliver adequate power levels for various functions, supporting robust performance.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables fine spacing between connections, which is ideal for high-density circuit layouts in advanced telecom systems.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0ET/C2EL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B64

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

PN5120A0ET/C2EL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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