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PN5120A0ET/C2J

NXP Semiconductors

PN5120A0ET/C2J by NXP Semiconductors

PN5120A0ET/C2J by NXP Semiconductors is a telecom interface IC with 64 terminals in a square package. Operating at -30 to 85°C, it requires 3/3.3V power supply and has a peak reflow temp of 260°C. Ideal for applications requiring fine pitch grid array style packages.

Median Price

$7.764

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,040 parts In-Stock

1+ parts

$9.870

100+ parts

$7.486

1k+ parts

$6.602

10k+ parts

$6.149

3,040

$9.870

$7.486

$6.602

$6.149

Flip Electronics (Authorized)

USA . 120,000 parts In-Stock

1+ parts

-

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120,000

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Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$5.657

8,000

-

-

-

$5.657

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$4.557

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$4.557

-

-

-

Digiode

USA . 1,394 parts In-Stock

1+ parts

$10.326

100+ parts

-

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10k+ parts

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1,394

$10.326

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Flip Electronics

USA . 120,000 parts In-Stock

1+ parts

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100+ parts

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120,000

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Vyrian

USA . 8,835 parts In-Stock

1+ parts

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8,835

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Anansix

USA . 1,561 parts In-Stock

1+ parts

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1,561

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.466

100+ parts

-

1k+ parts

$4.287

10k+ parts

-

500

$4.466

-

$4.287

-

Ampacity Inc.

Singapore . 61,239 parts In-Stock

1+ parts

$7.620

100+ parts

-

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61,239

$7.620

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Corphita

USA . 2,877 parts In-Stock

1+ parts

$9.783

100+ parts

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2,877

$9.783

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UNI Independent Distributors

Spain . 4,052 parts In-Stock

1+ parts

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100+ parts

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4,052

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Unlock the potential of seamless connectivity with the PN5120A0ET/C2J by NXP Semiconductors. Crafted with precision and expertise, this innovative product sets new standards in the telecom interface IC category. Designed for reliability and performance, this Square package body material device offers a wealth of applications and benefits to customers. Experience unparalleled value and efficiency with the PN5120A0ET/C2J, where quality meets cutting-edge technology. Elevate your connectivity experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and labor costs.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, enabling compact and streamlined designs.

Power Supplies (V): 3/3.3

Multiple power supply options provide flexibility in compatibility with different systems, increasing the versatility of the product.

No. of Terminals: 64

With a high number of terminals, this product can support a wide range of functions and connectivity options.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style allows for high-density mounting and enhanced performance in the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the product in various environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: BOTTOM

Bottom terminal position simplifies the manufacturing process and enables easier access during maintenance or repairs.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures that the product can withstand the soldering process without damage.

Terminal Form: BALL

Ball terminal form facilitates secure connections with the circuit board, reducing the risk of disconnection or signal loss.

Maximum Supply Current: 100 mA

High maximum supply current capability allows the product to support power-hungry devices or functions without overheating or failure.

Terminal Pitch: 0.635 mm

Fine terminal pitch enables precise placement and alignment on the circuit board, leading to optimal signal transmission and performance.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0ET/C2J attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B64

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

PN5120A0ET/C2J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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