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PN5120A0HN/C1,551

NXP Semiconductors

PN5120A0HN/C1,551 by NXP Semiconductors

PN5120A0HN/C1,551 by NXP Semiconductors is a versatile telecom interface IC with a 40-terminal chip carrier design. It operates at power supplies of 1.8/3.3V and supports temperatures from -30 °C to 85 °C, making it ideal for various applications in communication systems. Its surface mount and no-lead features enhance integration in compact devices.

Median Price

$4.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$4.590

1k+ parts

$4.110

10k+ parts

$3.860

11

-

$4.590

$4.110

$3.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,561 parts In-Stock

1+ parts

$4.854

100+ parts

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1,561

$4.854

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Vyrian

USA . 6,318 parts In-Stock

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6,318

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Anansix

USA . 2,151 parts In-Stock

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2,151

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,257 parts In-Stock

1+ parts

$4.599

100+ parts

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2,257

$4.599

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AZTECH Wire

Italy . 1,069 parts In-Stock

1+ parts

$13.550

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1,069

$13.550

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UNI Independent Distributors

Spain . 6,801 parts In-Stock

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6,801

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Perfect Parts

USA . 2,762 parts In-Stock

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2,762

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Assy Fe

Spain . 340 parts In-Stock

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340

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Cyclops Electronics Ltd (Excess)

UK . 8 parts In-Stock

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8

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Overview

Elevate your designs with the PN5120A0HN/C1,551 by NXP Semiconductors, a leading provider known for its exceptional quality and innovation. This versatile telecom interface IC seamlessly bridges connections, ensuring reliable performance across applications from smart devices to industrial automation. With robust temperature resilience and a compact design, it delivers unmatched efficiency, empowering you to create cutting-edge solutions that truly stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and protection, ensuring that the product is resilient in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCBs, making this IC suitable for space-constrained applications.

Package Shape: SQUARE

The square shape facilitates efficient use of PCB real estate and allows for better thermal performance.

Power Supplies (V): 1.8/3.3, 2.5/3.3

The wide range of operating voltages enhances compatibility with various systems and simplifies design considerations for developers.

No. of Terminals: 40

A higher number of terminals enables more functionality and connections, making this IC versatile for complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style is ideal for offering a robust connection and is suitable for high-density applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for use in environments with moderate to high thermal conditions.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C ensures reliability in cold environments, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and ensures reliable electrical performance over time.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing and connection, improving design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow characteristics favor compatibility with automated assembly processes, enhancing production efficiency.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows the IC to withstand demanding soldering processes, ensuring robust assembly.

Terminal Form: NO LEAD

No-lead terminals provide improved electrical performance and reduce environmental impact, adhering to modern manufacturing standards.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density design layout, which is a significant advantage for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for reasonable handling and storage requirements in production.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0HN/C1,551 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PN5120A0HN/C1,551 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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