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TCP-3082H-QT

Onsemi

TCP-3082H-QT by Onsemi

TCP-3082H-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,391 parts In-Stock

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Digiode

USA . 1,599 parts In-Stock

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1,599

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Distributors (Availability)

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AZTECH Wire

Italy . 398 parts In-Stock

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$19.320

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398

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Kulean Microsystems

USA . 5,602 parts In-Stock

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Problanco Electronics

Mexico . 5,400 parts In-Stock

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TANS Electronics

Latvia . 3,731 parts In-Stock

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SupplyDigital Components

Austria . 2,713 parts In-Stock

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Corphita

USA . 2,061 parts In-Stock

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UHIMA Technologies

Türkiye . 300 parts In-Stock

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Corohmni

South Africa . 99 parts In-Stock

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Overview

Discover the superior quality and reliability of the TCP-3082H-QT by Onsemi, a leading manufacturer in the industry. This innovative product falls under the category of Other Function Telecom Interface ICs, offering countless applications in the telecommunications sector. With its surface mount capability, compact rectangular package shape, and very thin profile, this chip carrier provides seamless integration into various devices. Experience the value and benefits that Onsemi's TCP-3082H-QT brings to your projects, from enhanced performance to streamlined operations. Elevate your telecom circuits with this advanced solution today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easy and efficient mounting onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor for easy integration into existing designs.

No. of Terminals: 6

Having 6 terminals allows for multiple connections and functions within the IC.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier with a very thin profile enables compact designs and efficient use of space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability under various operating conditions.

Minimum Operating Temperature: -30 °C

Wide range of minimum operating temperature allows for operation in diverse environments.

Terminal Position: QUAD

Quad terminal positions enable secure and stable connections for improved performance.

Maximum Seated Height: 1 mm

Low seated height facilitates compact designs and efficient use of vertical space.

Width: 1.2 mm

Narrow width contributes to space-saving and compact overall product design.

Length: 1.6 mm

Short length allows for placement in tight spaces and compact electronic devices.

Terminal Form: NO LEAD

No lead terminal form ensures reliable and long-lasting connections without risk of lead contamination.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and optimized performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and increased functionality in a small footprint.

Technical Specifications

Other Function Telecom Interface ICs TCP-3082H-QT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

TCP-3082H-QT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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