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FBGA Other Function uPs,uCs & Peripheral ICs 227

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TDA8026ET/C2,518 by NXP Semiconductors

TDA8026ET/C2,518

NXP Semiconductors

TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.

S-PBGA-B64

e1

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,551 by NXP Semiconductors

TDA8026ET/C2,551

NXP Semiconductors

NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,557 by NXP Semiconductors

TDA8026ET/C2,557

NXP Semiconductors

TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

PN7120A0EV/C10801E by NXP Semiconductors

PN7120A0EV/C10801E

NXP Semiconductors

NXP Semiconductors' PN7120A0EV/C10801E is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. It features a grid array package style, ball terminal form, and tin silver copper finish. Ideal for applications requiring fine pitch surface mount technology in plastic/epoxy packages.

S-PBGA-B49

e1

3

49

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA49,7X7,20

SQUARE

GRID ARRAY, FINE PITCH

260

1.8

Not Qualified

Other uPs/uCs/Peripheral ICs

1.8 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

MCIMX535DVV1B by Freescale Semiconductor

MCIMX535DVV1B

Freescale Semiconductor

MCIMX535DVV1B by Freescale Semiconductor is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 85 °C, with supply voltage range of 1.2-1.3 V. Ideal for applications requiring fine pitch grid array package style and 529 terminals in a square shape.

S-PBGA-B529

e2

19 mm

3

529

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

Not Qualified

1.85 mm

1.3 V

1.2 V

1.25 V

YES

CMOS

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

TMS320DM6467CCUT4 by Texas Instruments

TMS320DM6467CCUT4

Texas Instruments

TMS320DM6467CCUT4 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTAV by Texas Instruments

TMS320DM6467CCUTAV

Texas Instruments

TMS320DM6467CCUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It supports I2C, PCI, SPI, UART, USB buses and has a terminal pitch of 0.8 mm. Ideal for industrial applications requiring high-speed data processing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTD7 by Texas Instruments

TMS320DM6467CCUTD7

Texas Instruments

TMS320DM6467CCUTD7 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at -40 to 85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. Ideal for industrial applications requiring a CMOS technology-based microprocessor circuit in a compact square package.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV by Texas Instruments

TMS320DM6467CCUTV

Texas Instruments

TMS320DM6467CCUTV by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports various bus compatibilities like I2C, PCI, SPI, UART, and USB. Ideal for applications requiring a high-performance microprocessor circuit in a compact square package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT by Texas Instruments

TMS320DM6467CCUT

Texas Instruments

TMS320DM6467CCUT by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a fixed-point format and external data bus width of 16 bits.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CGUTA6 by Texas Instruments

TMS320DM6467CGUTA6

Texas Instruments

TMS320DM6467CGUTA6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and uses CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a PLASTIC/EPOXY package style with 529 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e0

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

220

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN LEAD

BALL

.8 mm

BOTTOM

20

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT1 by Texas Instruments

TMS320DM6467TCUT1

Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It has a supply voltage range of 1.235-1.365 V and supports Ethernet, I2C, SPI, UART, USB buses. Ideal for applications requiring high-speed processing in compact devices.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT9 by Texas Instruments

TMS320DM6467TCUT9

Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It features 8192 RAM words, 48-bit external data bus width, and supports Ethernet, I2C, SPI, UART & USB. Ideal for applications requiring high-speed processing in a compact form factor.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUTD1 by Texas Instruments

TMS320DM6467TCUTD1

Texas Instruments

TMS320DM6467TCUTD1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. Ideal for industrial applications, it supports Ethernet, I2C, SPI, UART, and USB bus compatibility with a supply voltage range of 1.3-3.3V.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT9 by Texas Instruments

TMS320DM6467TZUT9

Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3V, it has a max supply voltage of 1.365V and supports power supplies of 1.8/3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact form factor, with a package style of GRID ARRAY and FINE PITCH.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS32DM6467CCUTAV6 by Texas Instruments

TMS32DM6467CCUTAV6

Texas Instruments

TMS32DM6467CCUTAV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It features a package style of GRID ARRAY, FINE PITCH and supports I2C, PCI, SPI, UART, USB buses. Ideal for industrial applications requiring high-performance computing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA6 by Texas Instruments

TMS320DM6467CCUTA6

Texas Instruments

TMS320DM6467CCUTA6 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating b/w 0-85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring fixed-point format processing in various industries.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA by Texas Instruments

TMS320DM6467CCUTA

Texas Instruments

TMS320DM6467CCUTA by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates b/w 0-85°C, supports I2C, PCI, SPI, UART, USB buses and has a supply voltage range of 1.14-1.26V. Ideal for applications requiring high processing power in compact designs.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV6 by Texas Instruments

TMS320DM6467CCUTV6

Texas Instruments

TMS320DM6467CCUTV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It has a package style of grid array and fine pitch, with a terminal finish of Sn/Ag/Cu. Ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT7 by Texas Instruments

TMS320DM6467CZUT7

Texas Instruments

TMS320DM6467CZUT7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 0-85°C, it has a supply voltage range of 1.14-3.3V and peak reflow temperature of 245°C. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTAV by Texas Instruments

TMS320DM6467CZUTAV

Texas Instruments

TMS320DM6467CZUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It has a package style of GRID ARRAY, FINE PITCH and terminal finish of TIN SILVER COPPER. Ideal for industrial applications requiring high processing power in compact form factor.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTD7 by Texas Instruments

TMS320DM6467CZUTD7

Texas Instruments

TMS320DM6467CZUTD7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.26 V and supports power supplies of 1.2, 1.8, and 3.3 V. Ideal for industrial applications requiring a high-performance microprocessor circuit in a compact square package style with grid array terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT by Texas Instruments

TMS320DM6467CZUT

Texas Instruments

TMS320DM6467CZUT by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT1 by Texas Instruments

TMS320DM6467TZUT1

Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85 °C. It has a max supply voltage of 1.365 V and is suitable for MICROPROCESSOR CIRCUIT applications due to its CMOS technology and fine pitch package style.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUTD1 by Texas Instruments

TMS320DM6467TZUTD1

Texas Instruments

TMS320DM6467TZUTD1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.365 V and is ideal for industrial applications requiring MICROPROCESSOR CIRCUIT technology.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

LH7A400N0E000B3A by NXP Semiconductors

LH7A400N0E000B3A

NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

S-XBGA-B256

256

70 Cel

0 Cel

CERAMIC

FBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

LH7A404N0E000B0A by NXP Semiconductors

LH7A404N0E000B0A

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;

S-XBGA-B324

324

70 Cel

0 Cel

CERAMIC

FBGA

BGA324,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

TMS320DM6467ZUT7 by Texas Instruments

TMS320DM6467ZUT7

Texas Instruments

TMS320DM6467ZUT7 by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. Operating at 1.14-1.26 V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

32768

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467ZUTAV by Texas Instruments

TMS320DM6467ZUTAV

Texas Instruments

TMS320DM6467ZUTAV by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 105°C, suitable for industrial applications. With a package style of grid array and fine pitch, it has a terminal pitch of 0.8mm and requires supply voltages of 1.2V, 1.8V, and 3.3V.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

32768

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467ZUTA by Texas Instruments

TMS320DM6467ZUTA

Texas Instruments

TMS320DM6467ZUTA by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 105°C and has a max supply voltage of 1.26V. Ideal for industrial applications requiring high processing power in a compact form factor.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

32768

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467ZUTD7 by Texas Instruments

TMS320DM6467ZUTD7

Texas Instruments

TMS320DM6467ZUTD7 by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Features include 529 terminals, package style GRID ARRAY, and power supplies of 1.2V, 1.8V, and 3.3V.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

32768

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

LS1088ASE7PTA by NXP Semiconductors

LS1088ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASE7Q1A by NXP Semiconductors

LS1088ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7MQA by NXP Semiconductors

LS1088ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7PTA by NXP Semiconductors

LS1088ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7MQA by NXP Semiconductors

LS1088AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7PTA by NXP Semiconductors

LS1088AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7Q1A by NXP Semiconductors

LS1088AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7MQA by NXP Semiconductors

LS1088AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7PTA by NXP Semiconductors

LS1088AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7Q1A by NXP Semiconductors

LS1088AXN7Q1A

NXP Semiconductors

LS1088AXN7Q1A by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.995V to 1.055V. Ideal for applications requiring high performance and compact design.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6D7CVT08AE by NXP Semiconductors

MCIMX6D7CVT08AE

NXP Semiconductors

MCIMX6D7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V, making it ideal for industrial applications requiring high performance and reliability in a compact square package.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP7CVT8AB by NXP Semiconductors

MCIMX6DP7CVT8AB

NXP Semiconductors

MCIMX6DP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package style.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q7CVT08AE by NXP Semiconductors

MCIMX6Q7CVT08AE

NXP Semiconductors

MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AB by NXP Semiconductors

MCIMX6QP7CVT8AB

NXP Semiconductors

MCIMX6QP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high performance in compact form factors.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP4AVT8AAR by NXP Semiconductors

MCIMX6DP4AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP4AVT8ABR by NXP Semiconductors

MCIMX6DP4AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA624,25X25,32;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AAR by NXP Semiconductors

MCIMX6DP6AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC