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TMS320DM6467ZUTD7

Texas Instruments

TMS320DM6467ZUTD7 by Texas Instruments

TMS320DM6467ZUTD7 by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Features include 529 terminals, package style GRID ARRAY, and power supplies of 1.2V, 1.8V, and 3.3V.

Median Price

$131.558

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 631 parts In-Stock

1+ parts

-

100+ parts

$116.940

1k+ parts

$104.630

10k+ parts

$98.470

631

-

$116.940

$104.630

$98.470

DigiKey

USA . 631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

631

-

-

-

-

Verical

USA . 627 parts In-Stock

1+ parts

-

100+ parts

$146.175

1k+ parts

$130.787

10k+ parts

$123.088

627

-

$146.175

$130.787

$123.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,375 parts In-Stock

1+ parts

$123.434

100+ parts

-

1k+ parts

-

10k+ parts

-

3,375

$123.434

-

-

-

DigiKey Marketplace

USA . 631 parts In-Stock

1+ parts

$135.130

100+ parts

-

1k+ parts

-

10k+ parts

-

631

$135.130

-

-

-

Vyrian

USA . 6,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,674

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 79 parts In-Stock

1+ parts

$26.235

100+ parts

$23.874

1k+ parts

$21.513

10k+ parts

-

79

$26.235

$23.874

$21.513

-

Corohmni

South Africa . 4,871 parts In-Stock

1+ parts

$56.262

100+ parts

-

1k+ parts

-

10k+ parts

-

4,871

$56.262

-

-

-

Parana Technologies

USA . 1,906 parts In-Stock

1+ parts

$64.662

100+ parts

$6,004.853

1k+ parts

$58.196

10k+ parts

-

1,906

$64.662

$6,004.853

$58.196

-

DigiPath Technology Company

USA . 2,069 parts In-Stock

1+ parts

$71.201

100+ parts

-

1k+ parts

-

10k+ parts

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2,069

$71.201

-

-

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ChromeModa Solutions

Germany . 5,472 parts In-Stock

1+ parts

$72.654

100+ parts

$59.576

1k+ parts

-

10k+ parts

-

5,472

$72.654

$59.576

-

-

IDEA Electronic Components Group

UK . 2,144 parts In-Stock

1+ parts

$72.654

100+ parts

$69.021

1k+ parts

$65.389

10k+ parts

-

2,144

$72.654

$69.021

$65.389

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Corphita

USA . 3,190 parts In-Stock

1+ parts

$116.937

100+ parts

-

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10k+ parts

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3,190

$116.937

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Microchip USA

USA . 3,846 parts In-Stock

1+ parts

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100+ parts

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3,846

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Overview

Experience top-notch performance with the TMS320DM6467ZUTD7 by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. With Texas Instruments' reputation for quality and innovation, this product delivers exceptional value, efficiency, and reliability. Whether you're working on industrial automation, telecommunications, or automotive systems, this versatile IC will exceed your expectations. Upgrade your projects today with the TMS320DM6467ZUTD7 and unleash its full potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Package Shape: SQUARE

Square packages are easy to handle and can be mounted on PCBs efficiently, providing a stable and secure connection.

Bit Size: 32

A 32-bit architecture allows for faster processing and enhanced performance, making the product suitable for applications requiring high computational power.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with various system requirements.

No. of Terminals: 529

A high number of terminals provide ample connectivity options and interfaces, enabling versatile integration with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

A grid array with fine pitch layout allows for high density packaging, maximizing component density on the PCB and reducing footprint.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing the product's reliability.

Maximum Operating Temperature: 85 °C

A high operating temperature range ensures the product's reliability in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range enables the product to function in extreme cold environments, ensuring operational reliability in diverse settings.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position improves heat dissipation and facilitates efficient PCB layout design, enhancing overall performance and reliability.

Maximum Seated Height: 3.3 mm

The low seated height makes the product suitable for compact designs and space-constrained applications, improving overall system integration.

RAM Words: 32768

A large RAM capacity enables efficient data processing and storage, enhancing the product's performance in memory-intensive applications.

Width: 19 mm

Compact width dimension allows for space-efficient PCB layout design, making the product ideal for applications with limited space availability.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for extended durations, ensuring reliable solder connections and overall product durability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for robust solder joints and reliability during the assembly process.

Length: 19 mm

Compact length dimension enables space-efficient PCB layout design, contributing to overall system miniaturization and optimization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality, enabling complex operations and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable solder joints, ensuring robust electrical interfaces for the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures optimal performance and power efficiency, meeting the energy requirements of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density packaging and efficient PCB layout design, enhancing the product's integration capabilities.

Format: FIXED POINT

Fixed-point format enables precise arithmetic calculations, making the product suitable for applications requiring accurate and predictable results.

Moisture Sensitivity Level (MSL): 4

MSL rating of 4 indicates moderate moisture sensitivity, requiring standard handling precautions during the assembly process to maintain product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467ZUTD7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467ZUTD7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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