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TMS320DM6467ZUTA

Texas Instruments

TMS320DM6467ZUTA by Texas Instruments

TMS320DM6467ZUTA by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 105°C and has a max supply voltage of 1.26V. Ideal for industrial applications requiring high processing power in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,707 parts In-Stock

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Vyrian

USA . 3,285 parts In-Stock

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Cyclops Electronics Ltd

UK . 66 parts In-Stock

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AZTECH Wire

Italy . 676 parts In-Stock

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$11.665

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676

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One Stop Electronics

USA . 271 parts In-Stock

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$31.000

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Parana Technologies

USA . 2,372 parts In-Stock

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$65.683

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DigiPath Technology Company

USA . 429 parts In-Stock

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$72.325

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$66.539

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429

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Corohmni

South Africa . 2,932 parts In-Stock

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$72.584

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

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$73.801

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$70.111

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$66.421

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ChromeModa Solutions

Germany . 423 parts In-Stock

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$73.801

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$60.517

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Microchip USA

USA . 5,202 parts In-Stock

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Corphita

USA . 2,387 parts In-Stock

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GreenTree Electronics

Israel . 56 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the Texas Instruments TMS320DM6467ZUTA. Crafted by a renowned manufacturer, this cutting-edge microprocessor circuit offers endless possibilities in various applications. From enhancing audio and video processing to enabling advanced control systems, this product elevates your projects to new heights. With a focus on quality and reliability, Texas Instruments delivers a solution that guarantees value, benefits, and advantages for all customers. Experience the future of technology with the TMS320DM6467ZUTA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the product.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe and stable operation of the product within specified limits.

Package Shape: SQUARE

The square package shape helps in efficient placement and alignment of the product on the circuit board.

Bit Size: 32

The 32-bit size provides enhanced processing power and efficiency for complex tasks and applications.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple power supply options of 1.2V, 1.8V, and 3.3V offer flexibility and compatibility with various systems and requirements.

No. of Terminals: 529

The high number of terminals allows for extensive connectivity and functionality within the circuit design.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables precise connection and layout on the circuit board, enhancing overall performance.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures that the product can operate efficiently even under lower power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of temperature settings.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the circuit board, ensuring stable and reliable connections.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm enables compact and space-saving installation, ideal for applications with limited space.

RAM Words: 32768

The 32768 RAM words provide ample memory capacity for storing and processing data efficiently and effectively.

Width: 19 mm

The 19 mm width offers a compact form factor for easy integration into various electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures secure and reliable solder joints for durable and long-lasting performance.

Length: 19 mm

The 19 mm length provides a compact and efficient design for easy integration and installation in various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation and performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type enhances the product's processing capabilities and functionality for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for effective communication and operation within the circuit.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable and efficient operation under standard operating conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise and compact layout on the circuit board, optimizing space and connectivity.

Format: FIXED POINT

The fixed-point format allows for accurate and efficient numerical calculations and processing within the product.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates the level of protection required during storage and handling to prevent damage from moisture exposure.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467ZUTA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467ZUTA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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