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FBGA Other Function uPs,uCs & Peripheral ICs 227

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1084ASN7PTA by NXP Semiconductors

LS1084ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084ASN7Q1A by NXP Semiconductors

LS1084ASN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXE7MQA by NXP Semiconductors

LS1084AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXE7PTA by NXP Semiconductors

LS1084AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXE7Q1A by NXP Semiconductors

LS1084AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7MQA by NXP Semiconductors

LS1084AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7PTA by NXP Semiconductors

LS1084AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7Q1A by NXP Semiconductors

LS1084AXN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6D4AVT08AE by NXP Semiconductors

MCIMX6D4AVT08AE

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Length: 21 mm;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D4AVT10AER by NXP Semiconductors

MCIMX6D4AVT10AER

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D4AVT10AE by NXP Semiconductors

MCIMX6D4AVT10AE

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D5EYM10AER by NXP Semiconductors

MCIMX6D5EYM10AER

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT08AER by NXP Semiconductors

MCIMX6D6AVT08AER

NXP Semiconductors

MCIMX6D6AVT08AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V, it features a fine pitch grid array package style ideal for surface mount assembly.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT08AE by NXP Semiconductors

MCIMX6D6AVT08AE

NXP Semiconductors

MCIMX6D6AVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. Operating b/w -40 to 125 °C, it has a supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine-pitch grid arrays in plastic/epoxy packages.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT10AER by NXP Semiconductors

MCIMX6D6AVT10AER

NXP Semiconductors

MCIMX6D6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.35V to 1.5V, making it ideal for automotive applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT10AE by NXP Semiconductors

MCIMX6D6AVT10AE

NXP Semiconductors

MCIMX6D6AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine pitch grid array packages in surface mount technology.

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q4AVT10AER by NXP Semiconductors

MCIMX6Q4AVT10AER

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q4AVT10AE by NXP Semiconductors

MCIMX6Q4AVT10AE

NXP Semiconductors

MCIMX6Q4AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35V to 1.5V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT10AER by NXP Semiconductors

MCIMX6Q6AVT10AER

NXP Semiconductors

MCIMX6Q6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V and peak reflow temp of 260C, it's ideal for various uP/uC functions in surface-mount designs.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT10AE by NXP Semiconductors

MCIMX6Q6AVT10AE

NXP Semiconductors

MCIMX6Q6AVT10AE by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 125 °C and supports supply voltages from 1.35V to 1.5V. Ideal for applications requiring high-performance processing in compact electronic devices.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT10ADR by NXP Semiconductors

MCIMX6Q6AVT10ADR

NXP Semiconductors

MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

LS1046AXE8Q1A by NXP Semiconductors

LS1046AXE8Q1A

NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

MIMX8DX6AVLFZAC by NXP Semiconductors

MIMX8DX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8DX6AVLFZAC is a System on Chip with 609 terminals, operating temperature range of -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and is designed for automotive applications requiring high performance in a compact form factor.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX6AVLFZAC by NXP Semiconductors

MIMX8QX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

DRA784BSGABFQ1 by Texas Instruments

DRA784BSGABFQ1

Texas Instruments

DRA784BSGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at 32 MHz clock frequency. Ideal for automotive applications, it features a max supply voltage of 1.11 V and can withstand temperatures from -40 to 125 °C.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA784BSGABFRQ1 by Texas Instruments

DRA784BSGABFRQ1

Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFQ1 by Texas Instruments

DRA785BSGABFQ1

Texas Instruments

The Texas Instruments DRA785BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02V to 1.11V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFRQ1 by Texas Instruments

DRA785BSGABFRQ1

Texas Instruments

The Texas Instruments DRA785BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFQ1 by Texas Instruments

DRA788BSGABFQ1

Texas Instruments

The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFRQ1 by Texas Instruments

DRA788BSGABFRQ1

Texas Instruments

The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

MIMX8DX2AVLFZAC by NXP Semiconductors

MIMX8DX2AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX2AVOFZAC by NXP Semiconductors

MIMX8DX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX5AVLFZAC by NXP Semiconductors

MIMX8DX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVLFZAC by NXP Semiconductors

MIMX8QX2AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVOFZAC by NXP Semiconductors

MIMX8QX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVLFZAC by NXP Semiconductors

MIMX8QX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX5AVLFZAC by NXP Semiconductors

MIMX8QX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX1AVOFZAC by NXP Semiconductors

MIMX8DX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVOFZAC by NXP Semiconductors

MIMX8QX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX1AVLFZAC by NXP Semiconductors

MIMX8DX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX536AVP8C2 by NXP Semiconductors

MCIMX536AVP8C2

NXP Semiconductors

MCIMX536AVP8C2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.05V to 1.15V. Ideal for automotive applications due to AEC-Q100 screening level and fine pitch grid array package style.

S-PBGA-B529

e2

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

AEC-Q100

1.85 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX534AVP8C2 by NXP Semiconductors

MCIMX534AVP8C2

NXP Semiconductors

MCIMX534AVP8C2 by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.05V to 1.15V, it features a fine pitch grid array package style for surface mount assembly.

S-PBGA-B529

19 mm

529

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100

1.85 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

19 mm

SoC

DRA829VMTGBALFRQ1 by Texas Instruments

DRA829VMTGBALFRQ1

Texas Instruments

DRA829VMTGBALFRQ1 by Texas Instruments is a SoC with 827 terminals in a grid array package. It operates b/w -40 to 125 °C with supply voltage range of 0.76V to 0.84V. This IC is designed for automotive applications meeting AEC-Q100 standards.

S-PBGA-B827

e1

24 mm

3

827

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

SoC

LS1023AXE7QQB by NXP Semiconductors

LS1023AXE7QQB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;

S-PBGA-B621

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

21 mm

SoC

MPFS025T-FCVG484I by Microchip Technology

MPFS025T-FCVG484I

Microchip Technology

Microchip Technology's MPFS025T-FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SoC

MPFS160T-1FCVG784E by Microchip Technology

MPFS160T-1FCVG784E

Microchip Technology

MPFS160T-1FCVG784E by Microchip Technology is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This GRID ARRAY IC is ideal for applications requiring fine pitch and surface mount capabilities in electronic devices.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B784

23 mm

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

PROGRAMMABLE SoC

MPFS250T-1FCVG484E by Microchip Technology

MPFS250T-1FCVG484E

Microchip Technology

The Microchip Technology MPFS250T-1FCVG484E is a SoC peripheral IC with CMOS technology. It operates b/w 0°C to 100°C, with a supply voltage range of 0.97V to 1.03V. This grid array IC, measuring 19mm x 19mm, is ideal for applications requiring fine pitch and surface mount capabilities.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SoC

MPFS250T-1FCVG784I by Microchip Technology

MPFS250T-1FCVG784I

Microchip Technology

MPFS250T-1FCVG784I by Microchip Tech is a 784-terminal IC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring PROGRAMMABLE SoC in a SQUARE GRID ARRAY package style.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B784

23 mm

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

PROGRAMMABLE SoC