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MCIMX6D6AVT10AE

NXP Semiconductors

MCIMX6D6AVT10AE by NXP Semiconductors

MCIMX6D6AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine pitch grid array packages in surface mount technology.

Median Price

$81.020

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 18 parts In-Stock

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$48.930

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DigiKey

USA . 90 parts In-Stock

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$113.540

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$87.339

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$113.540

$87.339

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Mouser Electronics

USA . 61 parts In-Stock

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$120.210

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$95.550

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61

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$95.550

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Verical

USA . 300 parts In-Stock

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$81.020

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$81.020

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Flip Electronics (Authorized)

USA . 120 parts In-Stock

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120

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Rochester

USA . 40 parts In-Stock

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$73.390

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$65.660

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$61.800

40

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$65.660

$61.800

Distributors (In-Stock)

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Digiode

USA . 1,492 parts In-Stock

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$64.552

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Vyrian

USA . 6,649 parts In-Stock

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Anansix

USA . 1,162 parts In-Stock

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Flip Electronics

USA . 827 parts In-Stock

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Chip Stock

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625

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NAC Semi

USA . 120 parts In-Stock

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$94.850

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$87.550

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Nova Conductors

Japan . 50 parts In-Stock

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Corphita

USA . 2,427 parts In-Stock

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$61.155

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Corohmni

South Africa . 232 parts In-Stock

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$81.810

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Semicontronic

India . 124 parts In-Stock

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$125.040

100+ parts

$121.914

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$121.289

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124

$125.040

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$121.289

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Microchip USA

USA . 6,888 parts In-Stock

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$217.396

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Argo Parts USA

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UNI Independent Distributors

Spain . 7,849 parts In-Stock

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Continental Prestige Electronics

USA . 4,855 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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Aranea Global

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Infinite Electronics LLP (Excess)

. 161 parts In-Stock

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Overview

Discover the innovative MCIMX6D6AVT10AE by NXP Semiconductors, a cutting-edge solution in the category of Other Function uPs, uCs & Peripheral ICs. With a focus on quality and reliability, NXP Semiconductors delivers a product that exceeds expectations. This versatile device is designed to meet a variety of applications, providing customers with unparalleled value and benefits. Experience seamless performance, advanced technology, and unmatched efficiency with the MCIMX6D6AVT10AE. Elevate your projects to new heights with this exceptional offering from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the IC from damage, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto PCBs, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage allows for flexibility in power supply options for the product.

Package Shape: SQUARE

The square shape is easy to handle and integrate into PCB designs, making the product versatile for various applications.

No. of Terminals: 624

Having a high number of terminals allows for more connectivity options and functionalities in the product.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array style enables high density packaging and efficient signal routing for improved performance.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage ensures efficient power consumption and operation of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection for the product.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to mount the product onto PCBs and facilitates efficient heat dissipation.

Maximum Seated Height: 2.16 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 21 mm

The moderate width makes the product easy to handle and integrate into various designs without taking up too much space.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time helps prevent overheating of the product during assembly, ensuring reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and assembly processes without damaging the product.

Length: 21 mm

The moderate length provides flexibility in PCB layout and integration options, making the product versatile for different designs.

Peripheral IC Type: SoC

Being a System on Chip (SoC) peripheral IC type, the product offers integrated functionalities, simplifying design and reducing component count.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity for reliable performance.

Terminal Form: BALL

The ball terminal form enables easy and reliable connections, ensuring robust signal transmission and connectivity.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density connections and compact designs, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6D6AVT10AE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6D6AVT10AE Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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