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MCIMX6D6AVT10AER

NXP Semiconductors

MCIMX6D6AVT10AER by NXP Semiconductors

MCIMX6D6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.35V to 1.5V, making it ideal for automotive applications requiring high performance in compact spaces.

Median Price

$69.894

Lifecycle Status

Suppliers In-Stock

6

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1k+

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Verical

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Digiode

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Vyrian

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Nova Conductors

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Flip Electronics

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One Stop Electronics

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AZTECH Wire

Italy . 71 parts In-Stock

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Ampacity Inc.

Singapore . 410 parts In-Stock

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Semicontronic

India . 793 parts In-Stock

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Corohmni

South Africa . 969 parts In-Stock

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Microchip USA

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Discover the cutting-edge MCIMX6D6AVT10AER by NXP Semiconductors, a top-tier manufacturer known for its superior quality and innovation. This product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering a wide range of applications. With advanced technology and a reliable package style, this device provides unmatched value and benefits to customers. Experience seamless performance and versatility with the MCIMX6D6AVT10AER, perfect for automotive applications and beyond.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and ensures the product can withstand harsh operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage of 1.5 V ensures compatibility with various power sources and offers flexibility in application.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board and facilitates easier layout design.

No. of Terminals: 624

The high number of terminals provides ample connectivity options and supports complex circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier for installation and maintenance, especially in compact spaces.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed performance, making the product energy-efficient and reliable.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4 V offers a balanced power input for efficient operation and stable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6D6AVT10AER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6D6AVT10AER Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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