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FBGA Other Function uPs,uCs & Peripheral ICs 227

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XAZU5EV-1SFVC784I by Xilinx

XAZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784Q by Xilinx

XAZU5EV-1SFVC784Q

Xilinx

Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-L1SFVC784I by Xilinx

XAZU5EV-L1SFVC784I

Xilinx

Xilinx XAZU5EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This package features 784 terminals in a GRID ARRAY, FINE PITCH style, suitable for various uPs and uCs applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

AM5716AABCXEQ1 by Texas Instruments

AM5716AABCXEQ1

Texas Instruments

AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXQ1 by Texas Instruments

AM5716AABCXQ1

Texas Instruments

AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXEQ1 by Texas Instruments

AM5718AABCXEQ1

Texas Instruments

The Texas Instruments AM5718AABCXEQ1 is a SYSTEM ON CHIP with CMOS technology, operating at -40 to 125 °C. It features 760 terminals in a GRID ARRAY package style, suitable for automotive applications due to AEC-Q100 screening and low supply voltage of 1.11 V.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXQ1 by Texas Instruments

AM5718AABCXQ1

Texas Instruments

AM5718AABCXQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at 1.11-1.2V, suitable for automotive applications. With 760 terminals in a GRID ARRAY package style, it offers high performance at temperatures ranging from -40 to 125°C.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6DP4AVT8AB by NXP Semiconductors

MCIMX6DP4AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AB by NXP Semiconductors

MCIMX6DP6AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT08AE by NXP Semiconductors

MCIMX6Q6AVT08AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

LS1043AXN7PQB by NXP Semiconductors

LS1043AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1023AXE8PQB by NXP Semiconductors

LS1023AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043AXE8PQB by NXP Semiconductors

LS1043AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXE7PQB by NXP Semiconductors

LS1023AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXN8PQB by NXP Semiconductors

LS1043AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN8PQB by NXP Semiconductors

LS1023AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN7PQB by NXP Semiconductors

LS1023AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE7PQB by NXP Semiconductors

LS1043AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE8QQB by NXP Semiconductors

LS1043AXE8QQB

NXP Semiconductors

LS1043AXE8QQB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.87V to 0.93V. This IC has 780 terminals in a GRID ARRAY package style and is suitable for industrial applications.

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASE7MQA by NXP Semiconductors

LS1088ASE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1044ASE7MQA by NXP Semiconductors

LS1044ASE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044ASE7PTA by NXP Semiconductors

LS1044ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,32;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044ASE7Q1A by NXP Semiconductors

LS1044ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,32;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044ASN7MQA by NXP Semiconductors

LS1044ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044ASN7PTA by NXP Semiconductors

LS1044ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044ASN7Q1A by NXP Semiconductors

LS1044ASN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

S-PBGA-B780

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXE7MQA by NXP Semiconductors

LS1044AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXE7PTA by NXP Semiconductors

LS1044AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXE7Q1A by NXP Semiconductors

LS1044AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Width: 23 mm;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXN7MQA by NXP Semiconductors

LS1044AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXN7PTA by NXP Semiconductors

LS1044AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1044AXN7Q1A by NXP Semiconductors

LS1044AXN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;

S-PBGA-B780

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

LS1048ASE7MQA by NXP Semiconductors

LS1048ASE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048ASE7PTA by NXP Semiconductors

LS1048ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Width: 23 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048ASE7Q1A by NXP Semiconductors

LS1048ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048ASN7MQA by NXP Semiconductors

LS1048ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048ASN7PTA by NXP Semiconductors

LS1048ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048ASN7Q1A by NXP Semiconductors

LS1048ASN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXE7MQA by NXP Semiconductors

LS1048AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXE7PTA by NXP Semiconductors

LS1048AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXE7Q1A by NXP Semiconductors

LS1048AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXN7MQA by NXP Semiconductors

LS1048AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXN7PTA by NXP Semiconductors

LS1048AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1048AXN7Q1A by NXP Semiconductors

LS1048AXN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084ASE7MQA by NXP Semiconductors

LS1084ASE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-609 Code: e1;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084ASE7PTA by NXP Semiconductors

LS1084ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-609 Code: e1;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084ASE7Q1A by NXP Semiconductors

LS1084ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,32;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084ASN7MQA by NXP Semiconductors

LS1084ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP