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FBGA Other Function uPs,uCs & Peripheral ICs 227

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6DP6AVT8ABR by NXP Semiconductors

MCIMX6DP6AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

66AK2L06XCMS2 by Texas Instruments

66AK2L06XCMS2

Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA2 by Texas Instruments

66AK2L06XCMSA2

Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA by Texas Instruments

66AK2L06XCMSA

Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS by Texas Instruments

66AK2L06XCMS

Texas Instruments

The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP4AVT8AA by NXP Semiconductors

MCIMX6DP4AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AA by NXP Semiconductors

MCIMX6DP6AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP7CVT8AA by NXP Semiconductors

MCIMX6DP7CVT8AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AA by NXP Semiconductors

MCIMX6QP7CVT8AA

NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

DRA744BJGABCQ1 by Texas Instruments

DRA744BJGABCQ1

Texas Instruments

DRA744BJGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for AUTOMOTIVE applications, it features a PLASTIC/EPOXY Package Body Material and operates b/w -40 to 125 °C temperature range.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA744BJGABCRQ1 by Texas Instruments

DRA744BJGABCRQ1

Texas Instruments

DRA744BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA745BLGABCQ1 by Texas Instruments

DRA745BLGABCQ1

Texas Instruments

DRA745BLGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA745BLGABCRQ1 by Texas Instruments

DRA745BLGABCRQ1

Texas Instruments

DRA745BLGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40°C to 125°C.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA746BPGABCQ1 by Texas Instruments

DRA746BPGABCQ1

Texas Instruments

The Texas Instruments DRA746BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz clock frequency. Designed for AUTOMOTIVE applications, it features a package style of GRID ARRAY and supports CAN, I2C, SPI, UART, and USB bus compatibility.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA746BPGABCRQ1 by Texas Instruments

DRA746BPGABCRQ1

Texas Instruments

The Texas Instruments DRA746BPGABCRQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus, operating at up to 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C. This IC supports CAN, I2C, SPI, UART, and USB bus compatibility.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA750BJGABCRQ1 by Texas Instruments

DRA750BJGABCRQ1

Texas Instruments

DRA750BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 48-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

48

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA752BPGABCQ1 by Texas Instruments

DRA752BPGABCQ1

Texas Instruments

DRA752BPGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 760 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA752BPGABCRQ1 by Texas Instruments

DRA752BPGABCRQ1

Texas Instruments

DRA752BPGABCRQ1 by Texas Instruments is an automotive-grade microprocessor circuit with a CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a grid array package, it is suitable for automotive applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA756BPGABCQ1 by Texas Instruments

DRA756BPGABCQ1

Texas Instruments

The Texas Instruments DRA756BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

AM5716AABCDA by Texas Instruments

AM5716AABCDA

Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCD by Texas Instruments

AM5716AABCD

Texas Instruments

AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXA by Texas Instruments

AM5716AABCXA

Texas Instruments

AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCX by Texas Instruments

AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXA by Texas Instruments

AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCX by Texas Instruments

AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

XCZU2CG-2SFVC784E by Xilinx

XCZU2CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784E by Xilinx

XCZU2EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3CG-2SFVC784E by Xilinx

XCZU3CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3EG-2SFVC784E by Xilinx

XCZU3EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4CG-2SFVC784E by Xilinx

XCZU4CG-2SFVC784E

Xilinx

XCZU4CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with 0.85V supply voltage. Its 784-ball grid array package is ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU5CG-2SFVC784E by Xilinx

XCZU5CG-2SFVC784E

Xilinx

XCZU5CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w 0-100°C, it has a nominal voltage of 0.85V and terminal pitch of 0.8mm, suitable for various embedded applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SBVA484Q by Xilinx

XAZU2EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVA625I by Xilinx

XAZU2EG-1SFVA625I

Xilinx

Xilinx XAZU2EG-1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.85 V supply voltage. This IC has 625 terminals in a GRID ARRAY package style, suitable for industrial applications requiring fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVA625Q by Xilinx

XAZU2EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784I by Xilinx

XAZU2EG-1SFVC784I

Xilinx

Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784Q by Xilinx

XAZU2EG-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVA625I by Xilinx

XAZU2EG-L1SFVA625I

Xilinx

Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVC784I by Xilinx

XAZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVA625I by Xilinx

XAZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVA625Q by Xilinx

XAZU3EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784I by Xilinx

XAZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784Q by Xilinx

XAZU3EG-1SFVC784Q

Xilinx

Xilinx XAZU3EG-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8 mm and nominal voltage of 0.85 V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVA625I by Xilinx

XAZU3EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVC784I by Xilinx

XAZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-1SFVC784Q by Xilinx

XAZU4EV-1SFVC784Q

Xilinx

Xilinx XAZU4EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8mm and nominal voltage of 0.85V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-L1SFVC784I by Xilinx

XAZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT