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XCZU5CG-2SFVC784E

Xilinx

XCZU5CG-2SFVC784E by Xilinx

XCZU5CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w 0-100°C, it has a nominal voltage of 0.85V and terminal pitch of 0.8mm, suitable for various embedded applications.

Median Price

$2,120.280

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 31 parts In-Stock

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Vyrian

USA . 4,987 parts In-Stock

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Digiode

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VNN

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Ampacity Inc.

Singapore . 1,056 parts In-Stock

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$1.000

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Semicontronic

India . 1,130 parts In-Stock

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$16.000

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AZTECH Wire

Italy . 524 parts In-Stock

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One Stop Electronics

USA . 713 parts In-Stock

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MARBEL Systems

Belgium . 1,297 parts In-Stock

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$48.567

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$46.624

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Texas Native Microelectronics

USA . 45 parts In-Stock

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$55.824

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$53.591

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$51.916

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Kenton Components

USA . 367 parts In-Stock

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Corohmni

South Africa . 2,208 parts In-Stock

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Modulus Dynamics

Lithuania . 193 parts In-Stock

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Microchip USA

USA . 1,486 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Argo Parts USA

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Supply Digital

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Continental Prestige Electronics

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Qasali Group International

UK . 947 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and reliability with the XCZU5CG-2SFVC784E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology in the form of this versatile microprocessor circuit. This innovative product is ideal for a wide range of applications, providing customers with the value and benefits they need to stay ahead in today's competitive market. Trust Xilinx to provide you with top-quality solutions that bring your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and longevity are important.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into compact designs, saving space and reducing overall system size.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement on a PCB, making it a versatile choice for various layouts.

No. of Terminals: 784

The high number of terminals enables this product to accommodate a wide range of connections and interfaces, making it suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers enhanced reliability and signal integrity, making it a reliable choice for high-performance applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows this product to operate effectively in cold environments, expanding its range of potential applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection process, making it easy to integrate this product into existing systems or designs.

Maximum Seated Height: 3.32 mm

The low maximum seated height of this product allows for a slim and compact profile, ideal for applications where space constraints are a concern.

Width: 23 mm

The 23 mm width of this product offers a balance between compact size and ease of handling, making it suitable for various mounting configurations.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product can withstand the soldering process efficiently, ensuring a reliable connection.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability of 250°C enables this product to endure the soldering process without compromising its performance or integrity.

Length: 23 mm

The 23 mm length of this product provides a balanced form factor that can easily fit into different design layouts, offering flexibility in system integration.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type of this product allows for advanced processing capabilities and complex functions, making it suitable for applications requiring high computational power.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing its efficiency and reliability in various operating conditions.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates easy soldering, ensuring reliable performance and a robust electrical interface.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V offers compatibility with low-power systems, making this product an energy-efficient choice for battery-operated devices.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise placement on the PCB, enabling dense packing and efficient use of board space in tight layouts.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this product has a moderate level of moisture sensitivity, requiring standard handling and storage practices to maintain its performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-2SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.32 mm

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XCZU5CG-2SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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