Loading...

MCIMX6D6AVT08AE

NXP Semiconductors

MCIMX6D6AVT08AE by NXP Semiconductors

MCIMX6D6AVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. Operating b/w -40 to 125 °C, it has a supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine-pitch grid arrays in plastic/epoxy packages.

Median Price

$59.838

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,240 parts In-Stock

1+ parts

-

100+ parts

$53.190

1k+ parts

$47.590

10k+ parts

$44.790

7,240

-

$53.190

$47.590

$44.790

Verical

USA . 6,640 parts In-Stock

1+ parts

-

100+ parts

$66.487

1k+ parts

$59.487

10k+ parts

$55.987

6,640

-

$66.487

$59.487

$55.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,234 parts In-Stock

1+ parts

$56.145

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

$56.145

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$70.635

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$70.635

-

-

-

Chip Stock

USA . 6,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,047

-

-

-

-

Cyclops Electronics Ltd

UK . 4,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,547

-

-

-

-

Vyrian

USA . 3,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,694

-

-

-

-

Flip Electronics

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Anansix

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

245

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$8.114

100+ parts

-

1k+ parts

-

10k+ parts

-

778

$8.114

-

-

-

Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$50.230

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$50.230

-

-

-

Semicontronic

India . 50 parts In-Stock

1+ parts

$50.230

100+ parts

$48.974

1k+ parts

$48.723

10k+ parts

-

50

$50.230

$48.974

$48.723

-

Corphita

USA . 762 parts In-Stock

1+ parts

$53.190

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$53.190

-

-

-

Aztec Data Supply Inc.

USA . 585 parts In-Stock

1+ parts

$58.524

100+ parts

-

1k+ parts

-

10k+ parts

-

585

$58.524

-

-

-

Continental Prestige Electronics

USA . 5,015 parts In-Stock

1+ parts

$70.635

100+ parts

-

1k+ parts

-

10k+ parts

$69.222

5,015

$70.635

-

-

$69.222

Corohmni

South Africa . 1,166 parts In-Stock

1+ parts

$72.693

100+ parts

-

1k+ parts

-

10k+ parts

-

1,166

$72.693

-

-

-

Microchip USA

USA . 2,198 parts In-Stock

1+ parts

$143.866

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

$143.866

-

-

-

A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Lixinc

USA . 5,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,092

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Argo Parts USA

USA . 3,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,190

-

-

-

-

UNI Independent Distributors

Spain . 2,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$69.222

1k+ parts

$67.103

10k+ parts

$65.691

2,000

-

$69.222

$67.103

$65.691

Overview

Elevate your product designs with the MCIMX6D6AVT08AE by NXP Semiconductors, a cutting-edge solution in the category of Other Function uPs,uCs & Peripheral ICs. Manufactured with precision and expertise, this innovative device offers unparalleled quality and performance. From smart home devices to industrial automation systems, this product delivers exceptional value and benefits to customers looking to stay ahead of the competition. Trust NXP Semiconductors for reliability, efficiency, and top-notch technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.5 V

Operates efficiently within a low voltage range, reducing power consumption and heat generation.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards, maximizing the component density.

No. of Terminals: 624

Having a high number of terminals enables versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style ensures ease of assembly and reliability in high-density applications.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage requirement allows for operation in low-power environments, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions, increasing product reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to circuit boards, simplifying the installation process.

Maximum Seated Height: 2.16 mm

Low seated height profile saves space on the circuit board and reduces overall system size.

Width: 21 mm

Compact width dimension enables efficient placement on circuit boards with limited space.

Maximum Time At Peak Reflow Temperature (s): 40

Short peak reflow time minimizes the risk of component damage during soldering, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures component integrity during the soldering process.

Length: 21 mm

Compact length dimension allows for versatile placement options on circuit boards, optimizing layout design.

Peripheral IC Type: SoC

System-on-a-Chip technology integrates multiple functions into a single chip, reducing component count and circuit complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance efficiency.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable solder joints, ensuring long-term functionality.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and precise soldering, improving overall reliability and performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6D6AVT08AE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6D6AVT08AE Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20