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MCIMX6Q4AVT10AE

NXP Semiconductors

MCIMX6Q4AVT10AE by NXP Semiconductors

MCIMX6Q4AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35V to 1.5V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

Median Price

$60.780

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$60.780

100+ parts

$60.170

1k+ parts

$59.570

10k+ parts

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30

$60.780

$60.170

$59.570

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Verical

USA . 30 parts In-Stock

1+ parts

$60.780

100+ parts

$60.170

1k+ parts

$59.570

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30

$60.780

$60.170

$59.570

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EBV Elektronik

Germany . 120 parts In-Stock

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120

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Digiode

USA . 1,046 parts In-Stock

1+ parts

$127.954

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1,046

$127.954

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Maritex

Poland . 60 parts In-Stock

1+ parts

$136.037

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60

$136.037

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Vyrian

USA . 7,189 parts In-Stock

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7,189

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Anansix

USA . 711 parts In-Stock

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711

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TME

Poland . 120 parts In-Stock

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$116.600

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120

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$116.600

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 96 parts In-Stock

1+ parts

$21.820

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96

$21.820

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Corohmni

South Africa . 92 parts In-Stock

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$89.899

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$114.480

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15

$114.480

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Semicontronic

India . 15 parts In-Stock

1+ parts

$114.480

100+ parts

$111.618

1k+ parts

$111.046

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15

$114.480

$111.618

$111.046

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Microchip USA

USA . 1,047 parts In-Stock

1+ parts

$117.913

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1,047

$117.913

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Corphita

USA . 672 parts In-Stock

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$121.219

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672

$121.219

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UNI Independent Distributors

Spain . 1,827 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Experience the unparalleled quality and innovation of NXP Semiconductors with the MCIMX6Q4AVT10AE. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for your next project. With a package body material of PLASTIC/EPOXY and a maximum supply voltage of 1.5 V, this device is designed to deliver high performance in a compact form factor. Take advantage of its advanced technology and versatile applications, from IoT devices to industrial automation. Trust NXP Semiconductors to provide you with reliable solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, providing protection to the internal components of the IC.

Surface Mount: YES

Ease of assembly and compatibility with modern circuit board design practices.

Maximum Supply Voltage: 1.5 V

Low power consumption and compatibility with low-voltage applications.

Package Shape: SQUARE

Efficient use of space on the circuit board, allowing for compact and streamlined design.

No. of Terminals: 624

High pin count for extensive connectivity and functionality in the integrated circuit.

Package Style (Meter): GRID ARRAY, FINE PITCH

High-density packaging for optimal signal routing and reduced footprint.

Minimum Supply Voltage: 1.35 V

Support for low-power operation and flexibility in voltage requirements.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Extended temperature range for use in extreme conditions without sacrificing performance.

Terminal Position: BOTTOM

Simplified soldering process during assembly and secure connection to the PCB.

Maximum Seated Height: 2.16 mm

Low-profile design for space-constrained applications and efficient thermal management.

Width: 21 mm

Compact form factor for easy integration into electronic devices with limited space.

Maximum Time At Peak Reflow Temperature (s): 40

Time-saving reflow soldering process during assembly for increased productivity.

Peak Reflow Temperature °C: 260

High-temperature tolerance for reliable solder joints and robust performance.

Length: 21 mm

Balanced dimensions for a square package shape, ensuring uniformity in design.

Peripheral IC Type: SoC

Integration of multiple functions on a single chip for enhanced performance and efficiency.

Technology: CMOS

Low power consumption, high noise immunity, and compatibility with various digital applications.

Terminal Form: BALL

Ball grid array terminals for secure and reliable connections to the circuit board.

Terminal Pitch: 0.8 mm

Fine pitch terminals for high-density interconnection and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard reflow soldering processes and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q4AVT10AE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Q4AVT10AE Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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