Loading...

OMAPL137DZKBT3

Texas Instruments

OMAPL137DZKBT3 by Texas Instruments

OMAPL137DZKBT3 by Texas Instruments is a DSP with integrated cache and 8-bit data RAM. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, it offers efficient performance in compact designs.

Median Price

$28.115

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,840 parts In-Stock

1+ parts

$20.358

100+ parts

$18.096

1k+ parts

$13.306

10k+ parts

-

1,840

$20.358

$18.096

$13.306

-

DigiKey

USA . 67 parts In-Stock

1+ parts

$34.710

100+ parts

$24.873

1k+ parts

$23.844

10k+ parts

-

67

$34.710

$24.873

$23.844

-

Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$34.710

100+ parts

$24.180

1k+ parts

$23.840

10k+ parts

-

34

$34.710

$24.180

$23.840

-

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$21.520

1k+ parts

$19.250

10k+ parts

$18.120

6

-

$21.520

$19.250

$18.120

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,859 parts In-Stock

1+ parts

$17.556

100+ parts

-

1k+ parts

-

10k+ parts

-

4,859

$17.556

-

-

-

Vyrian

USA . 5,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,481

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,214 parts In-Stock

1+ parts

$16.632

100+ parts

-

1k+ parts

-

10k+ parts

-

3,214

$16.632

-

-

-

Component Stockers USA

USA . 418 parts In-Stock

1+ parts

$19.050

100+ parts

$20.450

1k+ parts

-

10k+ parts

-

418

$19.050

$20.450

-

-

Corohmni

South Africa . 2,456 parts In-Stock

1+ parts

$24.260

100+ parts

-

1k+ parts

-

10k+ parts

-

2,456

$24.260

-

-

-

Parana Technologies

USA . 2,211 parts In-Stock

1+ parts

$38.266

100+ parts

-

1k+ parts

-

10k+ parts

-

2,211

$38.266

-

-

-

DigiPath Technology Company

USA . 779 parts In-Stock

1+ parts

$42.135

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$42.135

-

-

-

ChromeModa Solutions

Germany . 691 parts In-Stock

1+ parts

$42.995

100+ parts

$35.256

1k+ parts

-

10k+ parts

-

691

$42.995

$35.256

-

-

IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$42.995

100+ parts

$40.845

1k+ parts

$38.696

10k+ parts

-

71

$42.995

$40.845

$38.696

-

Microchip USA

USA . 1,009 parts In-Stock

1+ parts

$48.840

100+ parts

$47.990

1k+ parts

$47.570

10k+ parts

$47.140

1,009

$48.840

$47.990

$47.570

$47.140

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Perfect Parts

USA . 345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

345

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Overview

Experience the unbeatable quality and performance of the OMAPL137DZKBT3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Digital Signal Processors (DSPs) like this one, designed with integrated cache and low power mode for optimal efficiency. With a wide range of applications in industries such as telecommunications, automotive, and industrial automation, this product offers customers unmatched value, benefits, and advantages. Elevate your projects with the OMAPL137DZKBT3 and experience superior processing power like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product suitable for various environments.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency, making this product ideal for high-performance applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power requirements, making this product versatile for different power systems.

Address Bus Width: 15

A wider address bus width allows for larger memory addressing capabilities, making this product suitable for applications that require extensive memory access.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions, making this product suitable for industrial applications.

No. of DMA Channels: 40

Having a high number of DMA channels allows for efficient data transfer and processing, making this product suitable for tasks that require high data throughput.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137DZKBT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

3

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

499712

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137DZKBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20