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OMAP3515ECUS72

Texas Instruments

OMAP3515ECUS72 by Texas Instruments

OMAP3515ECUS72 by Texas Instruments is a DSP with integrated cache, 32-bit RAM, and 59 MHz clock frequency. Ideal for applications requiring low power consumption and high-speed processing like digital signal processing tasks. Features include 423 terminals, 1.71-1.91 V supply voltage range, and compact square package design.

Median Price

$42.849

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 460 parts In-Stock

1+ parts

$42.849

100+ parts

$38.088

1k+ parts

$28.006

10k+ parts

-

460

$42.849

$38.088

$28.006

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,288 parts In-Stock

1+ parts

$40.707

100+ parts

-

1k+ parts

-

10k+ parts

-

2,288

$40.707

-

-

-

Vyrian

USA . 7,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,283

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$18.250

100+ parts

-

1k+ parts

-

10k+ parts

-

741

$18.250

-

-

-

Corohmni

South Africa . 2,230 parts In-Stock

1+ parts

$34.957

100+ parts

-

1k+ parts

-

10k+ parts

-

2,230

$34.957

-

-

-

Corphita

USA . 2,956 parts In-Stock

1+ parts

$38.564

100+ parts

-

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10k+ parts

-

2,956

$38.564

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-

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Parana Technologies

USA . 399 parts In-Stock

1+ parts

$47.562

100+ parts

-

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-

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399

$47.562

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-

-

DigiPath Technology Company

USA . 1,141 parts In-Stock

1+ parts

$52.372

100+ parts

-

1k+ parts

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10k+ parts

-

1,141

$52.372

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-

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ChromeModa Solutions

Germany . 3,573 parts In-Stock

1+ parts

$53.441

100+ parts

$43.822

1k+ parts

-

10k+ parts

-

3,573

$53.441

$43.822

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

1+ parts

$53.441

100+ parts

$50.769

1k+ parts

$48.097

10k+ parts

-

1,303

$53.441

$50.769

$48.097

-

Microchip USA

USA . 1,267 parts In-Stock

1+ parts

$94.330

100+ parts

$92.690

1k+ parts

$91.870

10k+ parts

$91.050

1,267

$94.330

$92.690

$91.870

$91.050

QUARKTWIN TECHNOLOGY LTD

USA . 15,234 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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15,234

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the OMAP3515ECUS72 Digital Signal Processor. This cutting-edge device offers superior performance and efficiency, making it ideal for a wide range of applications in industries such as telecommunications, automotive, and consumer electronics. With integrated cache and low power mode, this DSP provides unmatched value and benefits to customers looking for reliable solutions. Trust in Texas Instruments to deliver excellence in technology with the OMAP3515ECUS72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a long lifespan.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data, resulting in faster performance.

Maximum Supply Voltage: 1.91 V

Allows for higher voltage input, enabling the DSP to handle more demanding tasks.

Power Supplies (V): 1.1, 1.8, 3.3

Offers a range of power supply options for different applications, providing flexibility and compatibility.

RAM Words: 32768

Provides a large amount of memory for data storage and processing, making the DSP suitable for complex tasks.

Maximum Clock Frequency: 59 MHz

Enables high-speed processing, allowing the DSP to handle real-time data and calculations efficiently.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3515ECUS72 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

423

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3515ECUS72 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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