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OMAP3515ECUSA

Texas Instruments

OMAP3515ECUSA by Texas Instruments

OMAP3515ECUSA by Texas Instruments is a DSP with 32-bit data RAM, 423 terminals, and max clock frequency of 59 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include integrated cache, boundary scan support, and multiple power supply options.

Median Price

$42.849

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 886 parts In-Stock

1+ parts

$42.849

100+ parts

$38.088

1k+ parts

$28.006

10k+ parts

-

886

$42.849

$38.088

$28.006

-

Rochester

USA . 492 parts In-Stock

1+ parts

-

100+ parts

$40.270

1k+ parts

$36.030

10k+ parts

$33.910

492

-

$40.270

$36.030

$33.910

DigiKey

USA . 492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

492

-

-

-

-

Verical

USA . 492 parts In-Stock

1+ parts

-

100+ parts

$50.337

1k+ parts

$45.038

10k+ parts

$42.388

492

-

$50.337

$45.038

$42.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,565 parts In-Stock

1+ parts

$36.955

100+ parts

-

1k+ parts

-

10k+ parts

-

3,565

$36.955

-

-

-

DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

$40.460

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$40.460

-

-

-

Vyrian

USA . 6,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,506

-

-

-

-

Chip Stock

USA . 3,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,386

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 187 parts In-Stock

1+ parts

$23.215

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$23.215

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$26.024

100+ parts

$23.682

1k+ parts

$21.340

10k+ parts

-

2,500

$26.024

$23.682

$21.340

-

Corphita

USA . 3,294 parts In-Stock

1+ parts

$35.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,294

$35.010

-

-

-

Component Stockers USA

USA . 1,766 parts In-Stock

1+ parts

$40.150

100+ parts

$37.730

1k+ parts

-

10k+ parts

-

1,766

$40.150

$37.730

-

-

Parana Technologies

USA . 579 parts In-Stock

1+ parts

$55.006

100+ parts

-

1k+ parts

-

10k+ parts

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579

$55.006

-

-

-

DigiPath Technology Company

USA . 845 parts In-Stock

1+ parts

$60.568

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$60.568

-

-

-

ChromeModa Solutions

Germany . 4,464 parts In-Stock

1+ parts

$61.804

100+ parts

$50.679

1k+ parts

-

10k+ parts

-

4,464

$61.804

$50.679

-

-

IDEA Electronic Components Group

UK . 745 parts In-Stock

1+ parts

$61.804

100+ parts

$58.714

1k+ parts

$55.624

10k+ parts

-

745

$61.804

$58.714

$55.624

-

Overview

Unlock the power of cutting-edge technology with the OMAP3515ECUSA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a top-of-the-line Digital Signal Processor that offers unparalleled performance and reliability. With a wide range of applications in various industries, this product delivers exceptional value and benefits to customers looking for high-quality solutions. Experience seamless integration and superior functionality with the OMAP3515ECUSA, making it the perfect choice for all your digital processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

Integrated cache helps in improving data processing speed and efficiency, making the product suitable for high-performance applications.

Maximum Supply Voltage: 1.91 V

Ability to operate at a higher supply voltage provides flexibility in power requirements for different applications.

On Chip Data RAM Width: 32

Having a wider on-chip data RAM width allows for faster data access and processing, enhancing the overall performance of the product.

Package Shape: SQUARE

Square package shape ensures efficient use of space on a circuit board, making it easier for compact designs.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures allows the product to be used in a wide range of environments, including industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and suitable for battery-powered devices.

No. of DMA Channels: 32

Having a large number of DMA channels enables efficient data transfer between peripherals and memory, enhancing overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3515ECUSA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

423

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3515ECUSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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