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OMAP5910JGZG1

Texas Instruments

OMAP5910JGZG1 by Texas Instruments

OMAP5910JGZG1 by Texas Instruments is a 16-bit DSP with 24-bit address bus width, operating at a max clock frequency of 13 MHz. It features low power mode and boundary scan capabilities, making it ideal for industrial applications requiring high-speed digital signal processing in compact form factors.

Median Price

$43.830

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 342 parts In-Stock

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$38.960

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$34.860

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$32.810

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$32.810

Verical

USA . 342 parts In-Stock

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$48.700

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$43.575

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$41.013

342

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$41.013

Distributors (In-Stock)

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Digiode

USA . 1,385 parts In-Stock

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$41.126

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Vyrian

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Q Components

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Semi Source

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Nova Conductors

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Distributors (Availability)

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AZTECH Wire

Italy . 728 parts In-Stock

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$18.152

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$36.800

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Corphita

USA . 2,915 parts In-Stock

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$38.961

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Corohmni

South Africa . 58 parts In-Stock

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Parana Technologies

USA . 860 parts In-Stock

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DigiPath Technology Company

USA . 153 parts In-Stock

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$71.422

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$65.709

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

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$72.880

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$69.236

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$65.592

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ChromeModa Solutions

Germany . 65 parts In-Stock

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$72.880

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$59.762

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Continental Prestige Electronics

USA . 2,072 parts In-Stock

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Aranea Global

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Microchip USA

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Unlock a world of possibilities with the OMAP5910JGZG1 by Texas Instruments, a top-of-the-line Digital Signal Processor that redefines performance and innovation. Manufactured by the industry leader in cutting-edge technology, this processor offers unparalleled quality and reliability. Ideal for a wide range of applications, this DSP delivers exceptional value and benefits to customers seeking seamless integration, high-speed processing, and advanced functionality. Experience the advantages of Texas Instruments technology with the OMAP5910JGZG1 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology makes it easier to integrate the DSP onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.675 V

The high maximum supply voltage allows for flexibility in power supply options, making it easier to design around different power requirements.

Address Bus Width: 24

With a wide address bus width, the DSP can access a large amount of memory locations, enabling efficient data processing and storage.

Bit Size: 16

The 16-bit architecture allows for high precision calculations and processing, making the DSP suitable for a wide range of applications.

Power Supplies (V): 1.6, 1.8/2.75/3.3

The multiple power supply options cater to different voltage requirements, giving flexibility in system design and compatibility.

No. of Terminals: 289

The large number of terminals offers ample connectivity options, allowing for interfacing with various external devices and components.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package with a thin profile and fine pitch enhances thermal performance and signal integrity, contributing to efficient operation.

Minimum Supply Voltage: 1.525 V

The low minimum supply voltage helps optimize power consumption and efficiency, especially in low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can function reliably in harsh environmental conditions without risking overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the DSP can operate in extreme cold conditions, making it suitable for various industrial applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting of the DSP onto circuit boards, enhancing reliability and stability.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact and space-efficient PCB designs, which is advantageous in applications with size constraints.

RAM Words: 163840

The large RAM capacity enables efficient data processing and storage, accommodating complex algorithms and high-volume data handling.

Width: 12 mm

The compact width of the DSP makes it easy to integrate into electronic systems with limited space, without sacrificing performance.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production and maintenance, streamlining the development process.

External Data Bus Width: 16

The wide external data bus width enhances data transfer rates and throughput, enabling fast and efficient communication with external devices.

Maximum Clock Frequency: 13 MHz

With a high maximum clock frequency, the DSP can perform rapid data processing and execute instructions quickly, supporting real-time applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture improves data flow and parallel processing capabilities, enhancing overall performance and efficiency.

Length: 12 mm

The compact length of the DSP contributes to space-saving designs and easy integration into smaller electronic devices or systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments, offering robust performance and longevity.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type provides versatility for interfacing with various digital and analog devices, expanding the DSP's application range.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form simplifies soldering and improves electrical connections, ensuring secure attachment to PCBs for stable operation.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage provides a standard reference for system design and compatibility, ensuring consistent performance across different implementations.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on PCBs, optimizing layout efficiency and enabling miniaturization of electronic devices.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and reduces computational complexity, improving processing speed and efficiency.

Low Power Mode: YES

The low power mode enhances energy efficiency and prolongs battery life in portable devices, making the DSP suitable for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JGZG1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JGZG1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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