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TMS320C6657CZH25

Texas Instruments

TMS320C6657CZH25 by Texas Instruments

TMS320C6657CZH25 by Texas Instruments is a 32-bit DSP with integrated cache and 8-bit on-chip data RAM. It features 24-bit address bus width, operates at temperatures from 0 to 85°C, and has a terminal pitch of 0.8mm. Ideal for digital signal processing applications requiring high-speed performance and low power consumption.

Median Price

$95.530

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 150 parts In-Stock

1+ parts

$95.461

100+ parts

$92.590

1k+ parts

$71.775

10k+ parts

-

150

$95.461

$92.590

$71.775

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$150.000

100+ parts

$115.870

1k+ parts

-

10k+ parts

-

5

$150.000

$115.870

-

-

Chip1Stop

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

$95.530

1k+ parts

$93.790

10k+ parts

-

600

-

$95.530

$93.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,547 parts In-Stock

1+ parts

$90.688

100+ parts

-

1k+ parts

-

10k+ parts

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1,547

$90.688

-

-

-

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$107.660

100+ parts

-

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-

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870

$107.660

-

-

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Vyrian

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,400

-

-

-

-

Chip Stock

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

245

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 746 parts In-Stock

1+ parts

$5.042

100+ parts

-

1k+ parts

-

10k+ parts

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746

$5.042

-

-

-

Parana Technologies

USA . 1,660 parts In-Stock

1+ parts

$50.944

100+ parts

-

1k+ parts

-

10k+ parts

-

1,660

$50.944

-

-

-

DigiPath Technology Company

USA . 1,957 parts In-Stock

1+ parts

$56.095

100+ parts

-

1k+ parts

-

10k+ parts

-

1,957

$56.095

-

-

-

ChromeModa Solutions

Germany . 5,907 parts In-Stock

1+ parts

$57.240

100+ parts

$46.937

1k+ parts

-

10k+ parts

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5,907

$57.240

$46.937

-

-

IDEA Electronic Components Group

UK . 1,693 parts In-Stock

1+ parts

$57.240

100+ parts

$54.378

1k+ parts

$51.516

10k+ parts

-

1,693

$57.240

$54.378

$51.516

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Semicontronic

India . 228 parts In-Stock

1+ parts

$81.140

100+ parts

$79.112

1k+ parts

$78.706

10k+ parts

-

228

$81.140

$79.112

$78.706

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Ampacity Inc.

Singapore . 59 parts In-Stock

1+ parts

$81.140

100+ parts

-

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-

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59

$81.140

-

-

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Corphita

USA . 2,729 parts In-Stock

1+ parts

$85.915

100+ parts

-

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-

10k+ parts

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2,729

$85.915

-

-

-

Continental Prestige Electronics

USA . 5,933 parts In-Stock

1+ parts

$98.533

100+ parts

-

1k+ parts

-

10k+ parts

$96.562

5,933

$98.533

-

-

$96.562

Corohmni

South Africa . 3,011 parts In-Stock

1+ parts

$98.533

100+ parts

-

1k+ parts

-

10k+ parts

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3,011

$98.533

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$101.489

100+ parts

$96.415

1k+ parts

$96.415

10k+ parts

-

500

$101.489

$96.415

$96.415

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$107.660

100+ parts

$105.507

1k+ parts

-

10k+ parts

-

2,000

$107.660

$105.507

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-

Modulus Dynamics

Lithuania . 72 parts In-Stock

1+ parts

$109.371

100+ parts

$108.278

1k+ parts

$104.996

10k+ parts

-

72

$109.371

$108.278

$104.996

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Lixinc

USA . 6,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,820

-

-

-

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Argo Parts USA

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

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1,760

-

-

-

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

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-

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300

-

-

-

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.042

1k+ parts

$0.042

10k+ parts

$0.042

300

-

$0.042

$0.042

$0.042

Overview

Experience unparalleled performance and reliability with the TMS320C6657CZH25 by Texas Instruments, a leading manufacturer in the digital signal processor category. This cutting-edge product offers integrated cache, multiple power supply options, and advanced peripheral IC technology for a wide range of applications. With its high-quality package body material, fine pitch package style, and low power mode, this DSP provides unmatched value and benefits to customers seeking superior processing capabilities. Upgrade your system with the TMS320C6657CZH25 and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, cost-effective, and durable, making the product suitable for various applications.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP, providing faster data access for computations.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto printed circuit boards, saving space and reducing production costs.

Internal Bus Architecture: MULTIPLE

Using multiple internal bus architectures enhances data flow efficiency within the DSP, allowing for faster and more complex signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for prolonged operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6657CZH25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6657CZH25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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