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TMS320VC5509AGBB

Texas Instruments

TMS320VC5509AGBB by Texas Instruments

TMS320VC5509AGBB by Texas Instruments is a DSP with 16-bit data RAM, 21-bit address bus, and 128K RAM words. Ideal for industrial applications, it operates at up to 20 MHz clock frequency in temperatures ranging from -40 to 85°C. With low power mode and flash ROM programmability, it offers efficient signal processing capabilities.

Median Price

$26.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,555 parts In-Stock

1+ parts

$19.029

100+ parts

$16.621

1k+ parts

$11.463

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-

21,555

$19.029

$16.621

$11.463

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Mouser Electronics

USA . 660 parts In-Stock

1+ parts

$26.950

100+ parts

$18.780

1k+ parts

$18.530

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660

$26.950

$18.780

$18.530

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DigiKey

USA . 8 parts In-Stock

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$26.950

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8

$26.950

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Distributors (In-Stock)

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Digiode

USA . 4,265 parts In-Stock

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$18.078

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4,265

$18.078

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Nova Conductors

Japan . 900 parts In-Stock

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$19.940

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900

$19.940

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Vyrian

USA . 5,673 parts In-Stock

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5,673

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,001 parts In-Stock

1+ parts

$16.170

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-

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7,001

$16.170

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Corphita

USA . 1,603 parts In-Stock

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$17.126

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$17.126

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$19.541

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$18.760

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2,000

$19.541

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$18.760

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Continental Prestige Electronics

USA . 6,098 parts In-Stock

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$19.940

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$19.541

6,098

$19.940

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$19.541

Semicontronic

India . 7,241 parts In-Stock

1+ parts

$35.200

100+ parts

$34.320

1k+ parts

$34.144

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7,241

$35.200

$34.320

$34.144

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Corohmni

South Africa . 5,201 parts In-Stock

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$54.652

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$54.652

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Advanced Electronics

New Zealand . 80 parts In-Stock

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$67.141

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$63.784

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$63.784

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80

$67.141

$63.784

$63.784

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Parana Technologies

USA . 1,085 parts In-Stock

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$75.399

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DigiPath Technology Company

USA . 335 parts In-Stock

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$83.024

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$76.382

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335

$83.024

$76.382

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ChromeModa Solutions

Germany . 2,739 parts In-Stock

1+ parts

$84.718

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$69.469

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2,739

$84.718

$69.469

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IDEA Electronic Components Group

UK . 2,205 parts In-Stock

1+ parts

$84.718

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$80.482

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$76.246

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2,205

$84.718

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$76.246

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Lixinc

USA . 8,126 parts In-Stock

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Argo Parts USA

USA . 4,566 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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Futuretech Components

Singapore . 100 parts In-Stock

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Overview

Enhance your digital signal processing projects with the TMS320VC5509AGBB by Texas Instruments. This high-quality DSP offers superior performance and reliability, thanks to its cutting-edge technology and innovative design. Whether you're working on audio processing, telecommunications, or industrial control applications, this versatile processor delivers exceptional value and efficiency. Trust in Texas Instruments' reputation for excellence and choose the TMS320VC5509AGBB for all your signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Operating at a maximum supply voltage of 1.65V ensures efficient power consumption and helps in reducing overall power usage.

On Chip Data RAM Width: 16

The 16-bit on-chip data RAM width provides ample storage capacity for data processing, allowing for faster and efficient operation.

Address Bus Width: 21

The 21-bit address bus width enables access to a larger memory space, increasing the capabilities and processing power of the DSP.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy integration into various electronic devices and systems.

No. of Terminals: 179

Having 179 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the DSP.

Minimum Supply Voltage: 1.55 V

Operating at a minimum supply voltage of 1.55V ensures low power consumption and efficiency, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the DSP can operate reliably in a wide range of temperature conditions, increasing its applicability.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliable performance even in extreme cold environments, expanding the range of applications for the DSP.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures reliable electrical connections, making the DSP suitable for demanding industrial applications.

RAM Words: 128K

With 128K RAM words, the DSP has sufficient memory for storing and processing data, enabling complex signal processing tasks.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the DSP, improving reliability and reducing development time.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

Operating at a maximum clock frequency of 20 MHz enables fast signal processing and real-time computation, making the DSP suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 20

The DSP can withstand peak reflow temperature for 20 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 220

With a peak reflow temperature of 220°C, the DSP can be soldered using standard reflow processes, simplifying manufacturing.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data communication within the DSP, improving overall system performance and efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature range, the DSP can operate reliably in harsh industrial environments, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Featuring a digital signal processor with other peripheral IC types enhances the functionality and versatility of the DSP, allowing for a wider range of applications.

No. of Timers: 2

Having 2 timers allows for precise timing control and synchronization, enabling advanced signal processing and real-time operations.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and compatibility with various digital systems, making the DSP energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form allows for easy and reliable soldering connections, ensuring robust electrical connections and ease of assembly.

Nominal Supply Voltage: 1.6 V

Operating at a nominal supply voltage of 1.6V ensures stable and efficient power distribution, optimizing the performance of the DSP.

ROM Programmability: FLASH

Utilizing flash ROM programmability allows for easy updating and reprogramming of the DSP, enhancing flexibility and adaptability to changing requirements.

Format: FIXED POINT

Operating in fixed-point format simplifies signal processing algorithms, reducing computational complexity and improving processing speed.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the DSP is resistant to moisture-induced damage during storage and handling, ensuring long-term reliability and performance.

Low Power Mode: YES

The low power mode allows the DSP to operate in a power-saving state, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 16

The 16-bit on-chip program ROM width provides efficient storage capacity for program instructions, enabling fast and precise execution of signal processing algorithms.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AGBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PBGA-B179

JESD-609 Code:

e0

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA179(UNSPEC)

Package Shape:

Peak Reflow Temperature (C):

220

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Peripheral IC Type:

Trade Compliance

TMS320VC5509AGBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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