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TMS320VC5509APGER

Texas Instruments

TMS320VC5509APGER by Texas Instruments

TMS320VC5509APGER by Texas Instruments is a 16-bit DSP with 131072 RAM words, operating at 1.6V and 3.3V. It comes in a square flatpack package with 144 terminals, suitable for digital signal processing applications requiring fixed-point format and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,671 parts In-Stock

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Digiode

USA . 2,460 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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Ampacity Inc.

Singapore . 1,632 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 485 parts In-Stock

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$15.057

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485

$15.057

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Semicontronic

India . 1,626 parts In-Stock

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$18.000

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$17.550

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$17.460

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1,626

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One Stop Electronics

USA . 1,509 parts In-Stock

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$22.000

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1,509

$22.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$52.125

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$49.519

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$49.519

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$49.519

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Corohmni

South Africa . 4,934 parts In-Stock

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$58.962

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Parana Technologies

USA . 832 parts In-Stock

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$67.629

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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$74.468

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$68.511

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ChromeModa Solutions

Germany . 1,529 parts In-Stock

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$75.988

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$62.310

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IDEA Electronic Components Group

UK . 491 parts In-Stock

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$75.988

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$72.189

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$68.389

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491

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Argo Parts USA

USA . 4,133 parts In-Stock

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Continental Prestige Electronics

USA . 1,692 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

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$22.607

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450

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Corphita

USA . 227 parts In-Stock

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Overview

Unleash the power of digital signal processing with the TMS320VC5509APGER by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that revolutionizes industries. This DSP is perfect for applications in audio processing, telecommunications, and consumer electronics. With a 16-bit bit size and 131,072 RAM words, this processor offers unparalleled performance. Experience seamless integration with its surface mount and quad terminal position design. Elevate your projects with the TMS320VC5509APGER and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this DSP lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the DSP onto circuit boards.

Package Shape: SQUARE

The square package shape helps in maximizing space efficiency when designing circuit layouts.

Bit Size: 16

With a 16-bit size, this DSP can handle complex mathematical calculations and processing tasks with high precision.

Power Supplies (V): 1.6,3.3

The availability of multiple power supply options (1.6V and 3.3V) enhances flexibility in system design.

No. of Terminals: 144

The 144 terminals provide ample connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK

The flatpack package style offers thermal efficiency and reliability for better performance.

Terminal Position: QUAD

The quad terminal position enables easier soldering and connectivity during the assembly process.

RAM Words: 131072

With a large RAM capacity of 131072 words, this DSP can efficiently store and access data for processing tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type allows for various digital signal processing applications to be supported.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and solder joint reliability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-saving in system designs.

Format: FIXED POINT

The fixed-point format simplifies programming and algorithm implementation for signal processing operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509APGER attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

131072

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMS320VC5509APGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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