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TMS320F2808ZGMA

Texas Instruments

TMS320F2808ZGMA by Texas Instruments

TMS320F2808ZGMA by Texas Instruments is a 32-bit DSP with 100MHz clock frequency, 18432 RAM words, and flash ROM. Widely used in industrial applications for digital signal processing tasks due to its low power mode, multiple internal bus architecture, and 10 timers for precise control.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 4,290 parts In-Stock

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Digiode

USA . 1,240 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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AZTECH Wire

Italy . 399 parts In-Stock

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$6.152

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$12.000

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One Stop Electronics

USA . 621 parts In-Stock

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$24.000

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Parana Technologies

USA . 1,636 parts In-Stock

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DigiPath Technology Company

USA . 864 parts In-Stock

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$53.449

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ChromeModa Solutions

Germany . 6,670 parts In-Stock

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$54.540

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$44.723

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IDEA Electronic Components Group

UK . 1,111 parts In-Stock

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$51.813

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$49.086

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Corohmni

South Africa . 2,437 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience the power of innovation with the TMS320F2808ZGMA by Texas Instruments. As a leader in digital signal processors, Texas Instruments offers top-notch quality and reliability in every product. The TMS320F2808ZGMA is a game-changer in the DSP category, providing unmatched performance and versatility for a wide range of applications. From industrial automation to automotive systems, this cutting-edge processor delivers exceptional value, benefits, and advantages to customers seeking high-speed processing and seamless integration. Elevate your projects with the TMS320F2808ZGMA and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of voltage inputs.

Bit Size: 32

The 32-bit architecture provides high computational power and precision, making this DSP suitable for complex signal processing tasks.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures reliable performance in extreme environmental conditions, making it suitable for industrial applications.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency enables fast processing of signals, making this DSP ideal for real-time applications that require quick response times.

RAM Bytes: 36864

The large RAM capacity allows for efficient storage and retrieval of data during signal processing, enhancing the overall performance of the product.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product being a digital signal processor with additional peripheral IC types indicates versatility and compatibility with a wide range of applications requiring signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808ZGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808ZGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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