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DSPIC33CK64MC102T-E/M6

Microchip Technology

DSPIC33CK64MC102T-E/M6 by Microchip Technology

DSPIC33CK64MC102T-E/M6 by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 64 MHz. It has 8192 RAM words and operates at temperatures ranging from -40 to 125 °C. This DSP is commonly used in automotive applications due to its AEC-Q100 screening level and low power mode.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

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27

$1.510

-

-

-

Vyrian

USA . 766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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766

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,467 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

$1.480

5,467

$1.510

-

-

$1.480

Argo Parts USA

USA . 862 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

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10k+ parts

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862

$1.510

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-

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$19.070

100+ parts

-

1k+ parts

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459

$19.070

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Ampacity Inc.

Singapore . 461 parts In-Stock

1+ parts

$28.000

100+ parts

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1k+ parts

-

10k+ parts

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461

$28.000

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-

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Corohmni

South Africa . 497 parts In-Stock

1+ parts

$73.108

100+ parts

-

1k+ parts

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10k+ parts

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497

$73.108

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West Coast Incorporated

USA . 831 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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831

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.434

10k+ parts

$1.404

500

-

$1.480

$1.434

$1.404

Overview

Discover the power of the DSPIC33CK64MC102T-E/M6 by Microchip Technology. As a leading manufacturer in the industry, Microchip offers unmatched quality and reliability. This advanced digital signal processor opens up a world of possibilities with its wide range of applications. From automotive to industrial, this versatile chip delivers exceptional performance. With its high clock frequency and integrated peripherals, it enhances efficiency and streamlines processes. Benefit from its low power mode and flash programmability, allowing for flexibility and energy savings. Experience the advantages of the DSPIC33CK64MC102T-E/M6 and unlock your true potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the product, making it an ideal choice for applications that require reliable performance in challenging environments.

Surface Mount: YES

This feature allows for easy and efficient installation of the product onto circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wider range of power inputs, making it suitable for various applications with different power requirements.

On Chip Data RAM Width: 8

The wide on-chip data RAM width enables efficient data processing and storage, enhancing the performance and capabilities of the product.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that this product meets the strict automotive industry standards for reliability, making it a dependable choice for automotive applications.

Package Shape: SQUARE

The square package shape allows for easier integration into circuit boards and more compact designs, maximizing space utilization.

Bit Size: 16

The large bit size of 16 enhances the computational capability of this product, enabling it to handle complex signal processing tasks efficiently.

No. of Terminals: 28

With a sufficient number of terminals, this product can accommodate a wide range of input/output connections, expanding its versatility in various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, coupled with a heat sink/slug and a very thin profile, ensures effective heat dissipation and space-saving design for improved overall performance.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this product can operate efficiently at lower power levels, promoting energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows this product to operate reliably in demanding environments with elevated temperatures.

No. of External Interrupts: 4

The availability of multiple external interrupt channels enables the product to handle and respond to various real-time events, enhancing its versatility and responsiveness.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range enables this product to function reliably even in extremely cold conditions, making it suitable for wider application scenarios.

Terminal Position: QUAD

The terminal position of "QUAD" simplifies the installation and connection of external components, enabling ease of use and reducing assembly complexity.

Maximum Seated Height: 0.6 mm

With a low maximum seated height, this product can be easily integrated into compact and space-constrained designs, making it an ideal choice for size-sensitive applications.

RAM Words: 8192

The large number of RAM words provides ample memory capacity for data storage and processing, allowing for more complex signal processing tasks and improved overall performance.

Width: 4 mm

The compact width of 4 mm makes this product suitable for applications where space is limited, offering flexibility in design and integration.

Boundary Scan: YES

The presence of boundary scan capability allows for easier testing and debugging, simplifying the manufacturing and maintenance processes for improved efficiency.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency ensures fast and efficient data processing, making this product suitable for applications with high-performance requirements.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture increases the product's data throughput, enabling it to handle larger volumes of data and perform complex signal processing tasks efficiently.

Length: 4 mm

The compact length of 4 mm allows for space-efficient designs, providing flexibility in integrating this product into various applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive-grade applications, this product meets the stringent requirements and reliability standards demanded by the automotive industry, making it a reliable choice for automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and other peripheral IC type, this product offers specialized signal processing capabilities, making it an excellent choice for applications that require precise and efficient signal processing.

No. of Timers: 3

The availability of multiple timers allows for accurate control and synchronization of time-sensitive events, expanding the product's functionality and application possibilities.

Technology: CMOS

Utilizing CMOS technology, this product provides low power consumption, high noise immunity, and improved performance, making it an optimal choice for energy-efficient and high-performance applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process, minimizing the risk of damage during assembly and ensuring secure connections for reliable operation.

Maximum Supply Current: 29.6 mA

With a maximum supply current of 29.6 mA, this product operates within a low power range, promoting energy efficiency and extending battery life in power-constrained applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures a stable and consistent power supply, contributing to the reliability and performance of the product.

No. of DMA Channels: 4

The availability of multiple DMA channels allows for efficient data transfer and offloading of data processing tasks, enhancing the product's overall performance.

No. of Serial I/Os: 3

With multiple serial input/output interfaces, this product can communicate with various external devices and peripherals, expanding its compatibility and versatility.

ROM Programmability: FLASH

The flash ROM programmability provides flexibility for firmware updates and customization, allowing for future enhancements and adaptation to changing application requirements.

Terminal Pitch: 0.4 mm

With a small terminal pitch of 0.4 mm, this product enables high-density packaging, facilitating the integration of multiple components into limited space designs.

Format: FIXED POINT

The fixed-point format ensures precise and accurate numerical representation, making this product suitable for applications that require high precision and deterministic signal processing.

Low Power Mode: YES

The availability of a low power mode allows the product to operate in an energy-saving state when idle or during low activity periods, optimizing power efficiency and extending battery life.

Barrel Shifter: YES

The inclusion of a barrel shifter enables efficient and fast shifting operations, enhancing the computational capabilities of the product and improving its overall performance.

On Chip Program ROM Width: 24

With a wide on-chip program ROM width of 24, this product can store and execute complex program instructions efficiently, allowing for enhanced functionality and performance.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK64MC102T-E/M6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CK64MC102T-E/M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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