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DSPIC33EP512MU810-I/PF

Microchip Technology

DSPIC33EP512MU810-I/PF by Microchip Technology

DSPIC33EP512MU810-I/PF by Microchip Technology is a 16-bit digital signal processor with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for industrial applications requiring high-speed processing, it features 9 timers, 15 DMA channels, and FLASH ROM programmability.

Median Price

$11.029

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,877 parts In-Stock

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$9.700

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$9.330

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Chip1Stop

Japan . 95 parts In-Stock

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$10.800

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$9.000

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$8.980

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$10.800

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$8.980

Arrow

USA . 16 parts In-Stock

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$11.029

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$11.029

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Avnet

USA . 1,350 parts In-Stock

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Verical

USA . 180 parts In-Stock

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$18.902

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$18.902

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Master Electronics

USA . 101 parts In-Stock

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$11.220

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$10.540

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$11.220

$10.540

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$11.680

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1,000

$11.680

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NAC Semi

USA . 180 parts In-Stock

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$12.570

100+ parts

$11.400

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$10.430

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180

$12.570

$11.400

$10.430

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Maritex

Poland . 427 parts In-Stock

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$13.438

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Chip Stock

USA . 6,010 parts In-Stock

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RLX Solution Inc.

Canada . 2,058 parts In-Stock

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Vyrian

USA . 544 parts In-Stock

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IBS Electronics

USA . 101 parts In-Stock

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$15.736

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$14.782

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$14.782

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Electronics Depot

USA . 2 parts In-Stock

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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Semicontronic

India . 533 parts In-Stock

1+ parts

$8.240

100+ parts

$8.034

1k+ parts

$7.993

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533

$8.240

$8.034

$7.993

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Andel Nordic

Denmark . 5,189 parts In-Stock

1+ parts

$8.573

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$8.230

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$8.230

5,189

$8.573

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$8.230

$8.230

Continental Prestige Electronics

USA . 1,124 parts In-Stock

1+ parts

$10.530

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$9.300

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$10.530

$9.300

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Netroflash

USA . 100 parts In-Stock

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$11.680

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$11.680

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Modulus Dynamics

Lithuania . 4,065 parts In-Stock

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$16.288

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$16.288

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$16.288

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4,065

$16.288

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$16.288

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$17.950

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Aztec Data Supply Inc.

USA . 243 parts In-Stock

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$28.369

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$65.510

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$62.235

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$62.235

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$65.510

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Corohmni

South Africa . 84 parts In-Stock

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$68.689

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iodParts Technologies Inc.

India . 10,980 parts In-Stock

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Lixinc

USA . 9,066 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,928 parts In-Stock

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QualityLine Systems

Poland . 3,788 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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XL Components Corporation

Australia . 2,430 parts In-Stock

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Argo Parts USA

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Robosynatics

Brazil . 1,743 parts In-Stock

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$54.970

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$53.848

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$53.848

1,743

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$53.848

Lucentia Tech

USA . 1,743 parts In-Stock

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$54.970

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$53.848

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$53.848

1,743

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$53.848

$53.848

RC Electronics

USA . 1,563 parts In-Stock

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$11.100

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$10.130

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$9.830

1,563

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$10.130

$9.830

GreenTree Electronics

Israel . 779 parts In-Stock

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Eastek

USA . 239 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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Overview

Experience top-notch performance and efficiency with the DSPIC33EP512MU810-I/PF from Microchip Technology. As a leading manufacturer in the industry, Microchip offers unparalleled quality and reliability in digital signal processors. Ideal for a wide range of applications, this product provides customers with value and benefits that go beyond expectations. With cutting-edge technology and a variety of features, the DSPIC33EP512MU810-I/PF delivers exceptional performance and versatility for all your digital signal processing needs. Choose Microchip for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and protection to the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage offers flexibility in power supply options for the DSP.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient processing and storage of data within the DSP.

Package Shape: SQUARE

Square package shape ensures optimal space utilization on the PCB, enhancing overall design efficiency.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities for the DSP, suitable for a wide range of applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the DSP in various operating conditions.

No. of Terminals: 100

Abundance of terminals allows for versatile connectivity options, enabling integration with different external devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package styles enhances the overall compactness and efficiency of the DSP design.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in harsh environmental conditions.

No. of External Interrupts: 5

Multiple external interrupts enable the DSP to handle simultaneous events and improve responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures functionality in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position offers stable mounting and connectivity options on the PCB.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact PCB design and space-saving integration of the DSP.

RAM Words: 53248

Large RAM capacity enables efficient data processing and storage within the DSP.

Width: 14 mm

Compact width provides flexibility in PCB layout and integration of the DSP in space-constrained applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during the manufacturing process.

Maximum Clock Frequency: 60 MHz

High maximum clock frequency ensures fast processing speed and performance of the DSP.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time at peak reflow temperature ensures proper soldering and assembly of the DSP on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable and durable solder joints during PCB assembly.

Length: 14 mm

Compact length facilitates space-saving integration of the DSP on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the DSP in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller peripherals allows for versatile functionality and application compatibility.

No. of Timers: 9

Multiple timers enable precise timing control and scheduling in various DSP applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient DSP operation.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints and secure connectivity on the PCB.

Maximum Supply Current: 320 mA

Moderate supply current ensures energy efficiency and reliable performance of the DSP.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V meets the power requirements of the DSP for consistent performance.

No. of DMA Channels: 15

Abundance of DMA channels enables efficient data transfer and processing in the DSP, enhancing overall performance.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and customizable firmware updates in the DSP.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density mounting options, optimizing PCB layout and design.

Format: FLOATING POINT

Floating point format enhances the DSP's processing capabilities for complex mathematical operations and algorithms.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard PCB assembly and storage conditions.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extended battery life in portable DSP applications.

On Chip Program ROM Width: 8

Wide program ROM width enhances firmware storage capacity and flexibility in programming the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MU810-I/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33EP512MU810-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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