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DSPIC33EP512MU810-I/BG

Microchip Technology

DSPIC33EP512MU810-I/BG by Microchip Technology

DSPIC33EP512MU810-I/BG by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 3.3V supply, and 53248 RAM words. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and FLASH ROM programmability for efficient digital signal processing tasks.

Median Price

$11.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,548 parts In-Stock

1+ parts

$11.750

100+ parts

$9.770

1k+ parts

$8.990

10k+ parts

$8.540

3,548

$11.750

$9.770

$8.990

$8.540

Mouser Electronics

USA . 283 parts In-Stock

1+ parts

$11.750

100+ parts

$9.770

1k+ parts

-

10k+ parts

-

283

$11.750

$9.770

-

-

DigiKey

USA . 115 parts In-Stock

1+ parts

$11.750

100+ parts

$9.770

1k+ parts

-

10k+ parts

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115

$11.750

$9.770

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$11.250

100+ parts

-

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900

$11.250

-

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NAC Semi

USA . 2,760 parts In-Stock

1+ parts

$12.210

100+ parts

$11.070

1k+ parts

$10.120

10k+ parts

-

2,760

$12.210

$11.070

$10.120

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Vyrian

USA . 4,192 parts In-Stock

1+ parts

-

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4,192

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RLX Solution Inc.

Canada . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 151 parts In-Stock

1+ parts

$9.990

100+ parts

$9.740

1k+ parts

$9.690

10k+ parts

-

151

$9.990

$9.740

$9.690

-

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$9.990

100+ parts

-

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-

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3

$9.990

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Continental Prestige Electronics

USA . 4,991 parts In-Stock

1+ parts

$10.525

100+ parts

-

1k+ parts

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10k+ parts

$10.314

4,991

$10.525

-

-

$10.314

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$22.629

100+ parts

$21.498

1k+ parts

$21.498

10k+ parts

-

500

$22.629

$21.498

$21.498

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$24.428

100+ parts

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250

$24.428

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

1+ parts

$73.870

100+ parts

-

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271

$73.870

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Argo Parts USA

USA . 3,148 parts In-Stock

1+ parts

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3,148

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Lixinc

USA . 2,096 parts In-Stock

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2,096

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.097

1k+ parts

$0.097

10k+ parts

$0.097

100

-

$0.097

$0.097

$0.097

Fulton Briggs Corp.

USA . 37 parts In-Stock

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37

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Kepictronics

USA . 2 parts In-Stock

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Overview

Discover the unparalleled performance and versatility of the DSPIC33EP512MU810-I/BG by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in their products. This Digital Signal Processor (DSP) is perfect for a wide range of applications, offering customers seamless integration and exceptional efficiency. Experience the value of cutting-edge technology with the DSPIC33EP512MU810-I/BG, providing unmatched benefits and advantages that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements.

On Chip Data RAM Width: 8

Wide on chip data RAM allows for efficient processing of data.

Package Shape: SQUARE

A square package shape is often more space-efficient in circuit board design.

Bit Size: 16

The 16-bit architecture enables higher computational power and precision.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V simplifies power management in the system.

No. of Terminals: 121

Having a higher number of terminals provides more connectivity options for external components.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The package style enables high-density mounting, making it suitable for compact applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of real-time events.

Minimum Operating Temperature: -40 °C

The product can operate reliably in extreme cold temperatures.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering.

Maximum Seated Height: 1.2 mm

The low profile design with a maximum seated height of 1.2mm saves space in the overall system.

RAM Words: 53248

Having a large RAM capacity enables storage of a significant amount of data for processing.

Width: 10 mm

Compact width makes the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in debugging, testing, and ensuring product quality.

Maximum Clock Frequency: 60 MHz

A high maximum clock frequency allows for fast processing of instructions.

Length: 10 mm

Compact length contributes to space efficiency in system design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile peripheral IC type enables the product to perform a wide range of signal processing and control functions.

No. of Timers: 9

Multiple timers allow for precise timing control in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form simplifies soldering and provides good electrical connections.

Maximum Supply Current: 320 mA

The maximum supply current rating ensures proper functioning under load conditions.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage of 3.3V ensures consistent performance.

No. of DMA Channels: 15

Multiple DMA channels enhance data transfer efficiency and overall system performance.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy firmware updates.

Terminal Pitch: 0.8 mm

Compact terminal pitch of 0.8mm enables high-density mounting on PCBs.

Format: FLOATING POINT

Floating-point format supports precise numerical calculations in DSP applications.

Low Power Mode: YES

The low power mode option helps in reducing power consumption during idle or low processing tasks.

On Chip Program ROM Width: 8

Wide on-chip program ROM width allows for storage of program instructions for efficient execution.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MU810-I/BG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

121

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

DSPIC33EP512MU810-I/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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