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TMS32C6415EGLZA5E0

Texas Instruments

TMS32C6415EGLZA5E0 by Texas Instruments

TMS32C6415EGLZA5E0 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode capability.

Median Price

$154.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 56 parts In-Stock

1+ parts

$154.990

100+ parts

$143.530

1k+ parts

$139.620

10k+ parts

$139.220

56

$154.990

$143.530

$139.620

$139.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 210 parts In-Stock

1+ parts

$147.240

100+ parts

-

1k+ parts

-

10k+ parts

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210

$147.240

-

-

-

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$162.457

100+ parts

-

1k+ parts

-

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-

60

$162.457

-

-

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Vyrian

USA . 5,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,091

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$14.399

100+ parts

-

1k+ parts

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10k+ parts

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715

$14.399

-

-

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Corohmni

South Africa . 4,966 parts In-Stock

1+ parts

$19.398

100+ parts

-

1k+ parts

-

10k+ parts

-

4,966

$19.398

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$26.613

100+ parts

$24.218

1k+ parts

$21.823

10k+ parts

-

500

$26.613

$24.218

$21.823

-

Parana Technologies

USA . 1,067 parts In-Stock

1+ parts

$42.910

100+ parts

$3,984.887

1k+ parts

$38.619

10k+ parts

-

1,067

$42.910

$3,984.887

$38.619

-

DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

$47.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$47.250

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ChromeModa Solutions

Germany . 2,387 parts In-Stock

1+ parts

$48.214

100+ parts

$39.535

1k+ parts

-

10k+ parts

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2,387

$48.214

$39.535

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IDEA Electronic Components Group

UK . 1,554 parts In-Stock

1+ parts

$48.214

100+ parts

$45.803

1k+ parts

$43.393

10k+ parts

-

1,554

$48.214

$45.803

$43.393

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Corphita

USA . 2,175 parts In-Stock

1+ parts

$139.491

100+ parts

-

1k+ parts

-

10k+ parts

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2,175

$139.491

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$159.208

100+ parts

-

1k+ parts

$152.839

10k+ parts

-

1,000

$159.208

-

$152.839

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Continental Prestige Electronics

USA . 5,355 parts In-Stock

1+ parts

$162.457

100+ parts

-

1k+ parts

-

10k+ parts

$159.208

5,355

$162.457

-

-

$159.208

Ampacity Inc.

Singapore . 56 parts In-Stock

1+ parts

$286.730

100+ parts

-

1k+ parts

-

10k+ parts

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56

$286.730

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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15,000

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Argo Parts USA

USA . 4,072 parts In-Stock

1+ parts

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4,072

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Microchip USA

USA . 3,785 parts In-Stock

1+ parts

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3,785

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Perfect Parts

USA . 269 parts In-Stock

1+ parts

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100+ parts

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269

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Overview

Experience the cutting-edge technology of the TMS32C6415EGLZA5E0 by Texas Instruments, a top-of-the-line Digital Signal Processor designed to elevate your audio and video processing applications. With Texas Instruments' reputation for quality and innovation, this DSP delivers unparalleled performance and reliability. Whether you're working on telecommunications, multimedia systems, or industrial automation, this processor offers exceptional value with its integrated cache, low power mode, and high clock frequency. Stay ahead of the curve with the TMS32C6415EGLZA5E0 and experience the difference in efficiency and precision it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Integrated Cache: YES

Improves processing speed by storing frequently used data closer to the CPU, reducing latency.

Maximum Supply Voltage: 1.31 V

Allows for a higher voltage input, potentially increasing the performance capabilities of the DSP.

Address Bus Width: 32

Enables the DSP to access a large amount of memory locations, enhancing its processing capabilities.

Package Shape: SQUARE

Facilitates easy mounting and integration into electronic devices, optimizing space usage.

Power Supplies (V): 1.2,3.3

Provides flexibility in power input options, allowing the DSP to operate in a variety of environments.

No. of Terminals: 532

Offers a high level of connectivity options for interfacing with other components in a system.

Minimum Operating Temperature: -40 °C

Ensures the DSP can function effectively in extreme cold conditions, increasing its versatility.

Internal Bus Architecture: MULTIPLE

Enhances data transfer speeds and parallel processing capabilities, improving overall performance.

Maximum Clock Frequency: 75.18 MHz

Allows for fast processing speeds, making the DSP suitable for demanding real-time applications.

No. of DMA Channels: 64

Supports high-speed data transfers, reducing CPU overhead and improving system efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415EGLZA5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415EGLZA5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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