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DSP56F807PY80

NXP Semiconductors

DSP56F807PY80 by NXP Semiconductors

NXP Semiconductors' DSP56F807PY80 is a 16-bit DSP with 80 MHz clock frequency, ideal for industrial applications. Featuring 160 terminals in a low-profile flatpack package, it operates b/w -40 to 85°C with a supply voltage range of 3-3.6V. With boundary scan and barrel shifter, this CMOS technology-based processor offers efficient fixed-point processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 3,981 parts In-Stock

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Anansix

USA . 2,251 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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Bristol Electronics

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AZTECH Wire

Italy . 894 parts In-Stock

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Ampacity Inc.

Singapore . 190 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Corohmni

South Africa . 1,187 parts In-Stock

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Argo Parts USA

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Australia . 800 parts In-Stock

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Kepictronics

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Speed Components Ltd (Excess)

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors DSP56F807PY80 Digital Signal Processor. Designed with precision and expertise, this high-quality product offers unparalleled performance in a wide range of applications. From industrial automation to audio processing, this DSP provides customers with value, benefits, and advantages that go beyond expectations. Experience seamless integration, superior functionality, and reliable operation with the DSP56F807PY80 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages for more versatile applications.

Address Bus Width: 16

Provides sufficient address bus width for data processing tasks.

Package Shape: SQUARE

Helps in efficient placement on PCBs and saves space.

No. of Terminals: 160

Offers a good number of terminals for connectivity and interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal package style for compact and high-density applications.

Minimum Supply Voltage: 3 V

Works reliably with lower supply voltages, saving energy.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation.

Terminal Position: QUAD

Easier to solder and provides good mechanical stability.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 24 mm

Compact size for easy integration into various systems.

Boundary Scan: YES

Allows for efficient testing and debugging of the product during manufacturing.

External Data Bus Width: 16

Sufficient external data bus width for data transfer efficiency.

Maximum Clock Frequency: 80 MHz

Capable of high-speed operation for demanding processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing process.

Peak Reflow Temperature °C: 220

Withstands high reflow temperatures during assembly process.

Internal Bus Architecture: MULTIPLE

Efficient bus architecture for optimized data flow within the processor.

Length: 24 mm

Compact size for space-saving installations.

Temperature Grade: INDUSTRIAL

Can operate in industrial temperature environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC types for various signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Provides secure terminal connections for long-term reliability.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for stable performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact board designs.

Format: FIXED POINT

Specific fixed-point format for precise calculations.

Low Power Mode: YES

Energy-efficient low power mode for reduced power consumption.

Barrel Shifter: YES

Supports efficient data shifting operations for processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSP56F807PY80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G160

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

DSP56F807PY80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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