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DSPIC33EP128GS808T-E/PTVAO

Microchip Technology

DSPIC33EP128GS808T-E/PTVAO by Microchip Technology

DSPIC33EP128GS808T-E/PTVAO by Microchip is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It operates in automotive-grade temperatures from -40 to 125°C, making it ideal for automotive applications. With a supply voltage range of 3-3.6V and AEC-Q100 screening level, it offers reliable performance in harsh environments.

Median Price

$6.590

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$6.590

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Vyrian

USA . 916 parts In-Stock

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Continental Prestige Electronics

USA . 507 parts In-Stock

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$6.590

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$6.458

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Netroflash

USA . 100 parts In-Stock

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$6.590

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Ampacity Inc.

Singapore . 852 parts In-Stock

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AZTECH Wire

Italy . 666 parts In-Stock

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$15.070

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Aztec Data Supply Inc.

USA . 3,764 parts In-Stock

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$53.400

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Corohmni

South Africa . 303 parts In-Stock

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$61.780

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NIA Electronics

USA . 8,061 parts In-Stock

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Ledger Components

France . 8,061 parts In-Stock

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Argo Parts USA

USA . 1,407 parts In-Stock

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Montano Global Distributors

Canada . 810 parts In-Stock

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LMD Electronica

Estonia . 553 parts In-Stock

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LOOK Integrated Logistics

Peru . 126 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the DSPIC33EP128GS808T-E/PTVAO from industry leader Microchip Technology. This cutting-edge Digital Signal Processor is designed to meet the highest automotive standards, offering a wide range of applications for seamless integration in your projects. With advanced features and innovative technology, this product provides unmatched value and benefits to customers looking for top-notch quality and precision in their designs. Upgrade your systems with the DSPIC33EP128GS808T-E/PTVAO and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, offering flexibility in power supply options.

Screening Level: AEC-Q100; TS 16949

Meets automotive industry standards for quality and reliability, ensuring dependable performance in automotive applications.

Bit Size: 16

Offers high processing power and precision, suitable for demanding signal processing tasks.

No. of Terminals: 80

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact and space-saving design for efficient use of PCB real estate in tight applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperature environments, making it suitable for a wide range of applications.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast signal processing and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS808T-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ADC SAMPLE AND HOLD (5-CH 12-BIT)

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

DSPIC33EP128GS808T-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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