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DSPIC33EP256MC206T-E/MR

Microchip Technology

DSPIC33EP256MC206T-E/MR by Microchip Technology

DSPIC33EP256MC206T-E/MR by Microchip is a 16-bit DSP with max clock freq of 60MHz, operating temp range -40 to 125°C. Ideal for automotive applications, it features flash ROM programmability, 64 terminals in a square package shape, and operates at supply voltages b/w 3-3.6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,795 parts In-Stock

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2,795

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Nova Conductors

Japan . 35 parts In-Stock

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35

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Distributors (Availability)

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Semicontronic

India . 236 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

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236

$12.000

$11.700

$11.640

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AZTECH Wire

Italy . 379 parts In-Stock

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$18.743

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379

$18.743

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Ampacity Inc.

Singapore . 360 parts In-Stock

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$32.000

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360

$32.000

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Fulton Briggs Corp.

USA . 4,593 parts In-Stock

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4,593

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Continental Prestige Electronics

USA . 3,757 parts In-Stock

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3,757

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Argo Parts USA

USA . 3,481 parts In-Stock

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3,481

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Microchip USA

USA . 130 parts In-Stock

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130

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your projects with the Microchip Technology DSPIC33EP256MC206T-E/MR Digital Signal Processor. Known for its exceptional quality and precision engineering, Microchip Technology offers a wide range of applications in the DSP category. This innovative product brings value to customers by delivering high-performance processing capabilities, reliable operation, and efficient power management. Whether you're working on automotive applications or controller designs, this DSP provides the advanced features and benefits you need to take your projects to the next level. Experience the advantages of Microchip Technology and elevate your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, making it versatile for different power requirements.

Package Shape: SQUARE

Helps in efficient placement on the circuit board and conserving space.

Bit Size: 16

Provides adequate processing power for a wide range of digital signal processing tasks.

Power Supplies (V): 3.3

Standard power supply voltage for compatibility with various systems.

No. of Terminals: 64

Offers multiple connection points for interfacing with other electronic components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides different mounting options based on the specific requirements of the application.

Minimum Supply Voltage: 3 V

Can operate at a lower supply voltage, ensuring efficiency and power savings.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Offers a balanced layout for efficient signal routing and connectivity.

Maximum Seated Height: 1 mm

Low profile design for space-constrained installations.

Width: 9 mm

Compact size for easy integration into different electronic systems.

Maximum Clock Frequency: 60 MHz

High clock frequency for fast signal processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand high reflow temperatures for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability for secure solder joints.

Length: 9 mm

Compact size for efficient placement on circuit boards.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, suitable for automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Offers versatile functionality for digital signal processing and control applications.

Technology: CMOS

CMOS technology for low power consumption and high performance.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly and RoHS compliant design.

Maximum Supply Current: 60 mA

Low power consumption for energy efficiency.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with various systems.

ROM Programmability: FLASH

Flash programmable ROM for flexibility in firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch for compact layout and efficient use of board space.

Format: FLOATING POINT

Floating-point format for accurate and precise mathematical calculations.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design for reliability in humid environments.

On Chip Program ROM Width: 24

Wide ROM width for storing program instructions and data efficiently.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC206T-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MC206T-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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