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ADSP-21478BBCZ-2A

Analog Devices

ADSP-21478BBCZ-2A by Analog Devices

ADSP-21478BBCZ-2A by Analog Devices is a 40-bit DSP with 196 terminals, 16.67 MHz clock frequency, and 3145728 RAM words. Ideal for industrial applications, it features low power mode, floating-point format, and integrated cache for efficient signal processing tasks.

Median Price

$17.530

Lifecycle Status

Suppliers In-Stock

8

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Arrow

USA . 38 parts In-Stock

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Verical

USA . 38 parts In-Stock

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Analog Devices Inc

USA . 7 parts In-Stock

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$24.990

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$16.841

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Vyrian

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Chip Stock

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Nova Conductors

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Digiode

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Semicontronic

India . 54 parts In-Stock

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$16.990

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$16.565

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$16.480

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Ampacity Inc.

Singapore . 144 parts In-Stock

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$18.970

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Aztec Data Supply Inc.

USA . 2,857 parts In-Stock

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Parana Technologies

USA . 535 parts In-Stock

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IDEA Electronic Components Group

UK . 1,405 parts In-Stock

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Corohmni

South Africa . 5,128 parts In-Stock

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Advanced Electronics

New Zealand . 870 parts In-Stock

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DigiPath Technology Company

USA . 112 parts In-Stock

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$95.478

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$91.659

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

Australia . 450 parts In-Stock

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Perfect Parts

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Overview

Elevate your digital signal processing capabilities with the ADSP-21478BBCZ-2A by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers high-quality DSPs that are essential for a wide range of applications. With integrated cache, low power mode, and a peak clock frequency of 16.67 MHz, this product offers unparalleled performance and efficiency. Whether you're working on audio processing, telecommunications, or industrial control systems, the ADSP-21478BBCZ-2A is designed to meet your needs and exceed your expectations. Upgrade your projects with the cutting-edge technology and reliability that Analog Devices is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the DSP, making it durable and long-lasting.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power input, enabling varied applications.

On Chip Data RAM Width: 8

The wider data RAM width enhances the memory capacity and speed of the DSP.

Address Bus Width: 24

A wider address bus width allows for efficient data transfer and processing within the DSP.

Package Shape: SQUARE

The square shape makes it easier to mount and integrate the DSP into various systems and devices.

Bit Size: 40

The large bit size enables the DSP to handle complex calculations and processing tasks effectively.

No. of Terminals: 196

The high number of terminals allows for seamless connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with efficient signal routing for optimal performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in conserving power and reducing energy consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the DSP to function effectively in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy installation and connection of the DSP within a circuit.

Maximum Seated Height: 1.5 mm

The low maximum seated height enables slim and compact designs for devices using this DSP.

RAM Words: 3145728

The high number of RAM words provides ample storage capacity for data processing and storage.

Width: 12 mm

The compact width makes the DSP suitable for small-sized devices and systems.

Boundary Scan: YES

The boundary scan capability allows for efficient testing and debugging of the DSP during development and production.

External Data Bus Width: 16

The wide external data bus width enables fast data transfer between the DSP and external components.

Maximum Clock Frequency: 16.67 MHz

The high maximum clock frequency enhances the processing speed and efficiency of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and assembly of the DSP on PCBs.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture enhances data flow and processing capabilities within the DSP.

Length: 12 mm

The compact length allows for efficient space utilization in devices where the DSP is integrated.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the DSP in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type allows the DSP to handle both digital signal processing and other functions efficiently.

Technology: CMOS

The CMOS technology used in this DSP provides low power consumption and high efficiency in processing.

Terminal Form: BALL

The ball terminal form allows for reliable connections and easy installation of the DSP within a circuit.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable performance of the DSP.

No. of DMA Channels: 65

The high number of DMA channels allows for efficient data transfer and processing with external devices.

ROM Programmability: FLASH

The flash ROM programmability enables flexibility in firmware updates and customization of the DSP.

Terminal Pitch: 0.8 mm

The small terminal pitch makes it easier to design compact PCB layouts with the DSP integrated.

Format: FLOATING POINT

The floating-point format allows for accurate and precise numerical calculations in the DSP.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates that the DSP is suitable for reflow soldering processes and has moderate moisture sensitivity.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-processing tasks.

Barrel Shifter: YES

Having a barrel shifter capability enhances the DSP's ability to handle complex shift and rotate operations efficiently.

On Chip Program ROM Width: 8

The wide on-chip program ROM width allows for storing and executing larger programs within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21478BBCZ-2A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

40

Boundary Scan:

YES

Maximum Clock Frequency:

16.67 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

65

No. of Serial I/Os:

1

No. of Terminals:

196

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-21478BBCZ-2A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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