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DSPIC33EP256MU806-E/PTC01

Microchip Technology

DSPIC33EP256MU806-E/PTC01 by Microchip Technology

DSPIC33EP256MU806-E/PTC01 by Microchip Technology is a 16-bit digital signal processor with 28672 RAM words and 60 MHz clock frequency. It is ideal for applications requiring high-speed processing, such as automotive electronics, due to its AEC-Q100 screening level and low power mode. The package style is flatpack with thin profile, making it suitable for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 230 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 217 parts In-Stock

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$9.567

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$9.567

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Ampacity Inc.

Singapore . 1,501 parts In-Stock

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$31.000

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$31.000

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Semicontronic

India . 481 parts In-Stock

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$34.000

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$33.150

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$32.980

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481

$34.000

$33.150

$32.980

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Aztec Data Supply Inc.

USA . 1,189 parts In-Stock

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$49.320

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$49.320

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Corohmni

South Africa . 163 parts In-Stock

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$71.093

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$71.093

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$88.109

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$83.704

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$83.704

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$88.109

$83.704

$83.704

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NIA Electronics

USA . 8,231 parts In-Stock

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Ledger Components

France . 8,231 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,575 parts In-Stock

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Continental Prestige Electronics

USA . 6,486 parts In-Stock

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Argo Parts USA

USA . 4,366 parts In-Stock

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LMD Electronica

Estonia . 2,348 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Montano Global Distributors

Canada . 145 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology DSPIC33EP256MU806-E/PTC01! As a leader in the industry, Microchip Technology delivers top-quality digital signal processors that are perfect for a wide range of applications. Whether you're looking to enhance your audio systems, control motors, or optimize power management, this DSP offers unparalleled performance and efficiency. With advanced features like low power modes and a high clock frequency, this product provides customers with exceptional value and benefits. Trust Microchip Technology to deliver reliable solutions for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Easy to mount on circuit boards, reducing assembly time and cost.

Maximum Supply Voltage: 3.6 V

Provides a wide range of operating voltages for flexibility in various applications.

On Chip Data RAM Width: 8

Efficient handling of data with a wider RAM width.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive industry standards for reliable performance in harsh environments.

Package Shape: SQUARE

Compact shape for efficient use of space on circuit boards.

Bit Size: 16

Higher bit size for increased processing power and accuracy.

No. of Terminals: 64

Sufficient number of terminals for connectivity with external components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Multiple packaging options for flexibility in design and installation.

Minimum Supply Voltage: 3 V

Support for low power applications with a minimum supply voltage of 3 V.

Maximum Operating Temperature: 125 °C

Wide temperature range for operation in extreme conditions.

No. of External Interrupts: 5

Allows for external events to interrupt and handle specific tasks efficiently.

Minimum Operating Temperature: -40 °C

Support for operation in cold environments, ensuring versatility in applications.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

Maximum Seated Height: 1.2 mm

Low profile design for space-saving and compact installations.

RAM Words: 28672

Large RAM capacity for storing and processing a significant amount of data.

Width: 10 mm

Compact width for fitting into tight spaces on circuit boards.

Boundary Scan: YES

Boundary scan capability for testing and debugging during production and maintenance.

Maximum Clock Frequency: 60 MHz

High clock frequency for fast processing and response times.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for improved efficiency in data transfer.

Length: 10 mm

Compact length for space-efficient installations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile IC type for handling digital processing and control functions.

No. of Timers: 11

Multiple timers for precise timing and scheduling of tasks.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Maximum Supply Current: 95 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

No. of DMA Channels: 15

Multiple DMA channels for efficient data transfer and processing.

No. of Serial I/Os: 6

Sufficient serial I/Os for connecting to external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability for flexible and easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact and dense circuit board designs.

Format: FIXED POINT

Fixed-point format for precise and efficient numerical processing.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter for efficient and flexible bitwise operations.

On Chip Program ROM Width: 8

Program ROM width of 8 for efficient and fast program execution.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU806-E/PTC01 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

28672

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33EP256MU806-E/PTC01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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