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DSPIC33EP256MU806T-E/MR

Microchip Technology

DSPIC33EP256MU806T-E/MR by Microchip Technology

DSPIC33EP256MU806T-E/MR by Microchip is a 16-bit DSP with 3.6V max supply voltage, operating at up to 60MHz. Ideal for automotive applications, it features 28672 RAM words, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$8.000

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

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650

$8.000

-

-

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Vyrian

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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593

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,502 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

10k+ parts

-

1,502

$2.000

$1.950

$1.940

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AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$5.187

100+ parts

-

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783

$5.187

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Continental Prestige Electronics

USA . 5,392 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

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10k+ parts

$7.840

5,392

$8.000

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-

$7.840

Netroflash

USA . 100 parts In-Stock

1+ parts

$8.000

100+ parts

$7.840

1k+ parts

-

10k+ parts

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100

$8.000

$7.840

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Ampacity Inc.

Singapore . 205 parts In-Stock

1+ parts

$16.000

100+ parts

-

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205

$16.000

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Aztec Data Supply Inc.

USA . 3,862 parts In-Stock

1+ parts

$35.120

100+ parts

-

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3,862

$35.120

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$43.656

100+ parts

$41.473

1k+ parts

$41.473

10k+ parts

-

750

$43.656

$41.473

$41.473

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$62.161

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130

$62.161

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RGB Technical Solutions

Ukraine . 7,979 parts In-Stock

1+ parts

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7,979

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Argo Parts USA

USA . 3,887 parts In-Stock

1+ parts

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3,887

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Overview

Unlock the power of precision and efficiency with the Microchip Technology DSPIC33EP256MU806T-E/MR. Designed for high-performance applications, this Digital Signal Processor offers unparalleled quality and reliability. With a maximum clock frequency of 60 MHz and Flash ROM programmability, this versatile chip delivers optimal performance in automotive and industrial settings. Experience seamless integration and enhanced functionality with Microchip's cutting-edge technology. Elevate your projects to new heights with the DSPIC33EP256MU806T-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and flexibility, making the product durable and resistant to physical damage.

Maximum Supply Voltage: 3.6 V

Allows for a higher maximum voltage input, offering flexibility in power supply options.

Bit Size: 16

With a 16-bit processing capability, the product can handle more complex calculations and data manipulation efficiently.

RAM Words: 28672

With a large RAM capacity, the product can store and manipulate a significant amount of data at once, improving performance in multitasking scenarios.

Maximum Clock Frequency: 60 MHz

This high clock frequency allows for quick data processing and response times, making the product suitable for real-time applications.

ROM Programmability: FLASH

The ability to program the ROM using Flash technology enables easy firmware updates and customization, enhancing the product's versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency and reliability of the product.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand exposure to moderate humidity levels, ensuring reliability in varied environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU806T-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MU806T-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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