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DSPIC33EP512MC806T-E/MR

Microchip Technology

DSPIC33EP512MC806T-E/MR by Microchip Technology

DSPIC33EP512MC806T-E/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It has 53248 RAM words and can operate in automotive temperature grades. This DSP is commonly used in applications such as digital signal processing and control systems.

Median Price

$8.580

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.580

100+ parts

-

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50

$8.580

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Vyrian

USA . 4,326 parts In-Stock

1+ parts

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4,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$8.408

100+ parts

-

1k+ parts

$8.072

10k+ parts

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500

$8.408

-

$8.072

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Continental Prestige Electronics

USA . 2,729 parts In-Stock

1+ parts

$8.580

100+ parts

-

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$8.408

2,729

$8.580

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-

$8.408

Ampacity Inc.

Singapore . 1,528 parts In-Stock

1+ parts

$12.000

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1,528

$12.000

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AZTECH Wire

Italy . 197 parts In-Stock

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$16.025

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197

$16.025

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Semicontronic

India . 1,473 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

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1,473

$34.000

$33.150

$32.980

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Corohmni

South Africa . 154 parts In-Stock

1+ parts

$51.840

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154

$51.840

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Aztec Data Supply Inc.

USA . 3,043 parts In-Stock

1+ parts

$72.140

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3,043

$72.140

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Argo Parts USA

USA . 655 parts In-Stock

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655

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West Coast Incorporated

USA . 189 parts In-Stock

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189

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Microchip USA

USA . 102 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the DSPIC33EP512MC806T-E/MR by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology continues to deliver top-notch quality products that meet the demands of today's digital signal processing applications. With its cutting-edge technology and advanced features, this digital signal processor offers exceptional speed and efficiency, allowing you to achieve optimal results in your projects. Whether you're working on automotive systems, industrial automation, or consumer electronics, the DSPIC33EP512MC806T-E/MR provides the power and versatility you need. Trust Microchip Technology to provide you with the tools you need for success.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material provides durability and protection for the digital signal processor, making it suitable for various applications.

Surface Mount

YES. The surface mount technology allows for easy installation and integration of the digital signal processor into electronic devices or circuit boards.

Maximum Supply Voltage

3.6 V. The high maximum supply voltage ensures compatibility with power sources commonly used in electronic systems, providing reliable operation.

On Chip Data RAM Width

8. The wide data RAM width enhances the processor's ability to handle and process large amounts of data efficiently, improving overall performance.

Package Shape

SQUARE. The square package shape allows for compact and space-saving placement of the digital signal processor, suitable for applications with limited PCB real estate.

Bit Size

16. The 16-bit architecture enables the processor to handle complex calculations and tasks, offering enhanced precision and accuracy in signal processing applications.

No. of Terminals

64. The large number of terminals enables seamless connectivity and communication with external components, facilitating versatile integration into various electronic systems.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE. This package style provides effective heat dissipation, ensuring reliable operation under high thermal loads. The thin profile allows for space-efficient placement.

Minimum Supply Voltage

3 V. The low minimum supply voltage allows for compatibility with lower power sources, enabling energy-efficient operation and reducing power consumption.

Maximum Operating Temperature

125 °C. The high maximum operating temperature tolerance enables the digital signal processor to function reliably in demanding environmental conditions.

No. of External Interrupts

5. The presence of multiple external interrupts allows the processor to efficiently handle and respond to external events or interrupts, enhancing system responsiveness and flexibility.

Minimum Operating Temperature

40 °C. The low minimum operating temperature tolerance ensures reliable operation even in extremely cold environments, expanding the range of possible applications.

Terminal Finish

MATTE TIN. The matte tin finish provides corrosion resistance and a stable electrical connection, ensuring long-term reliability and improved signal integrity.

Terminal Position

QUAD. The quad terminal position allows for secure and stable connection to external circuitry, minimizing the potential for signal loss or interference.

Maximum Seated Height

1 mm. The low maximum seated height facilitates the integration of the digital signal processor into compact electronic systems and enables space-efficient PCB design.

RAM Words

53248. The large number of RAM words provides ample storage capacity for temporary data storage during signal processing tasks, enhancing the processor's ability to handle complex algorithms.

Width

9 mm. The compact width dimension allows for efficient placement of the digital signal processor in space-constrained electronic devices or PCB layouts.

Boundary Scan

YES. The presence of boundary scan capabilities enables efficient testing and debugging of the digital signal processor, simplifying the development and maintenance processes.

Maximum Clock Frequency

60 MHz. The high maximum clock frequency enables fast and efficient signal processing, allowing for real-time applications and high-speed data handling.

Maximum Time At Peak Reflow Temperature (s)

40. The specified maximum time at peak reflow temperature ensures proper soldering and reliable assembly of the digital signal processor during the manufacturing process.

Peak Reflow Temperature °C

260. The high peak reflow temperature tolerance allows for proper soldering and reliable connection of the digital signal processor to the PCB or electronic assembly.

Length

9 mm. The compact length dimension facilitates space-efficient placement and integration of the digital signal processor in electronic systems with limited physical dimensions.

Temperature Grade

AUTOMOTIVE. The automotive temperature grade indicates that the digital signal processor is specifically designed and qualified for use in automotive applications, ensuring reliability and performance under challenging automotive environments.

Peripheral IC Type

DIGITAL SIGNAL PROCESSOR, CONTROLLER. The digital signal processor also functions as a controller, providing versatile control capabilities in addition to advanced signal processing functionalities.

No. of Timers

9. The presence of multiple timers enhances the processor's ability to synchronize and manage time-based events or tasks, offering increased flexibility and control in various applications.

Technology

CMOS. The complementary metal-oxide-semiconductor (CMOS) technology provides efficient power consumption, high-performance capabilities, and compatibility with a wide range of electronic systems.

Terminal Form

NO LEAD. The no-lead terminal form simplifies assembly and soldering processes, reducing production costs and facilitating compatibility with modern lead-free requirements.

Maximum Supply Current

320 mA. The high maximum supply current ensures sufficient power delivery to the digital signal processor, supporting stable operation and allowing for demanding signal processing tasks.

Nominal Supply Voltage

3.3 V. The nominal supply voltage represents the recommended voltage level for optimal performance of the digital signal processor, ensuring reliable and efficient operation.

No. of DMA Channels

15. The presence of multiple direct memory access (DMA) channels allows for efficient and fast data transfer between external devices and the digital signal processor, enhancing overall system performance.

ROM Programmability

FLASH. The use of flash memory for programmability enables easy and secure updating of firmware or software on the digital signal processor, offering flexibility and adaptability.

Terminal Pitch

0.5 mm. The small terminal pitch facilitates precise and reliable connections to external circuitry, ensuring signal integrity and reducing the risk of signal distortion or loss.

Format

FLOATING POINT. The floating-point format enhances the precision and accuracy of numerical calculations, making the digital signal processor well-suited for complex mathematical operations in signal processing applications.

Moisture Sensitivity Level (MSL)

3. The moisture sensitivity level indicates the component's resistance to moisture absorption during handling and storage, ensuring the digital signal processor's reliability and performance.

Low Power Mode

YES. The availability of a low power mode allows the digital signal processor to operate with reduced power consumption, conserving energy and enabling longer battery life in portable devices.

On Chip Program ROM Width

8. The on-chip program ROM width of 8 enables the digital signal processor to store and execute programs or firmware, providing ample capacity for application-specific code.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MC806T-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP512MC806T-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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