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SM320F28335PTPS

Texas Instruments

SM320F28335PTPS by Texas Instruments

The Texas Instruments SM320F28335PTPS is a 32-bit DSP with 20-bit address bus width, operating at up to 100 MHz. Ideal for military applications, it features 17408 RAM words and 8 external interrupts. With low power mode and PWM channels, this DSP offers versatile digital signal processing capabilities in a compact package.

Median Price

$441.580

Lifecycle Status

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9

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Mouser Electronics

USA . 236 parts In-Stock

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$441.580

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DigiKey

USA . 179 parts In-Stock

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$441.610

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Nova Conductors

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Vyrian

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AZTECH Wire

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Parana Technologies

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$20.761

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$1,927.977

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$18.685

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DigiPath Technology Company

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IDEA Electronic Components Group

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Corohmni

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Ampacity Inc.

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Continental Prestige Electronics

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Argo Parts USA

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$365.820

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$362.162

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$358.504

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$354.845

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$362.162

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$354.845

Microchip USA

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM320F28335PTPS Digital Signal Processor. Known for its superior quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This versatile DSP is perfect for a wide range of applications, offering unmatched performance and efficiency. Experience seamless operation and unparalleled processing capabilities with the SM320F28335PTPS, providing customers with unbeatable value and exceptional benefits for all their digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, making it reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.995 V

A higher maximum supply voltage allows for flexibility in powering the DSP and compatibility with different voltage levels in the system.

Address Bus Width: 20

A wider address bus width enables the DSP to access a larger memory space, improving processing capabilities and overall performance.

Package Shape: SQUARE

Square package shape is efficient for space utilization and layout design, making it easier to integrate the DSP into various applications.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, enhancing the performance of the DSP in handling complex algorithms and calculations.

Power Supplies (V): 1.9, 3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources, enhancing the versatility of the DSP.

No. of Terminals: 176

Having a higher number of terminals allows for more connectivity options and interface capabilities, enabling the DSP to communicate effectively with other components in the system.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in mounting options and thermal management, catering to different application requirements for optimal performance.

Minimum Supply Voltage: 1.805 V

A low minimum supply voltage ensures efficient power consumption and extends the operational range of the DSP, making it suitable for a wide range of battery-powered applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions and extends the lifespan of the DSP for robust performance.

CPU Family: C28X

Belonging to the C28X CPU family, this DSP is designed for high-performance signal processing applications, offering advanced features and capabilities for demanding tasks.

No. of External Interrupts: 8

Having multiple external interrupts allows the DSP to quickly respond to events and handle real-time processing tasks efficiently, enhancing system responsiveness.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, the DSP can operate in extreme cold environments without compromising performance, making it suitable for various industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides corrosion resistance and ensures reliable connections, improving the longevity and stability of the DSP in different operating conditions.

ADC Channels: YES

Integrated ADC channels allow the DSP to directly sample and process analog signals, enabling seamless integration with sensor inputs and real-world data in signal processing applications.

Terminal Position: QUAD

Quad terminal position offers a secure and stable connection interface, minimizing signal interference and ensuring reliable data transmission for consistent performance.

Maximum Seated Height: 1.6 mm

With a low maximum seated height, the DSP can be easily accommodated in compact electronic devices or space-constrained applications, optimizing the overall system design.

RAM Words: 17408

Ample RAM storage capacity allows the DSP to store and manipulate large data sets efficiently, improving processing speed and enabling complex algorithms to be executed smoothly.

Width: 24 mm

Compact width dimensions make the DSP suitable for applications where space is limited, providing versatility in design and integration options for various electronic systems.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during production or maintenance, ensuring reliable operation and quick identification of any faults in the system.

External Data Bus Width: 32

A wide external data bus width enhances data transfer speeds and efficiency, enabling the DSP to handle large volumes of data effectively and improve overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) SM320F28335PTPS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

13

On Chip Program ROM Width:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

17408

ROM Programmability:

OTPROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SM320F28335PTPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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