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SM320C30HFGM28

Texas Instruments

SM320C30HFGM28 by Texas Instruments

The Texas Instruments SM320C30HFGM28 is a 32-bit DSP with 2048 RAM words, operating at up to 28 MHz. Ideal for military applications, it features a ceramic-metal package and operates in temperatures ranging from -55°C to 125°C. With a max supply voltage of 5.5V and power consumption of 500mA, this DSP offers high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,359 parts In-Stock

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7,359

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Digiode

USA . 2,368 parts In-Stock

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2,368

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Distributors (Availability)

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$8.840

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283

$8.840

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Parana Technologies

USA . 1,369 parts In-Stock

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$14.223

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$14.674

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1,369

$14.223

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$14.674

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DigiPath Technology Company

USA . 1,306 parts In-Stock

1+ parts

$15.661

100+ parts

$14.408

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1,306

$15.661

$14.408

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ChromeModa Solutions

Germany . 1,736 parts In-Stock

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$15.981

100+ parts

$13.104

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1,736

$15.981

$13.104

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IDEA Electronic Components Group

UK . 606 parts In-Stock

1+ parts

$15.981

100+ parts

$15.182

1k+ parts

$14.383

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606

$15.981

$15.182

$14.383

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One Stop Electronics

USA . 484 parts In-Stock

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$31.000

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484

$31.000

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Corphita

USA . 3,531 parts In-Stock

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Overview

Unlock the power of digital signal processing with the Texas Instruments SM320C30HFGM28. Crafted with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this state-of-the-art device delivers exceptional value and efficiency. Experience seamless integration, advanced features, and superior quality with Texas Instruments, setting new standards in the world of digital signal processors. Elevate your projects with the SM320C30HFGM28 and unleash limitless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for the product, making it suitable for harsh operating environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing and increased processing capabilities for the DSP.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB and allows for efficient heat dissipation.

Bit Size: 32

The 32-bit processing capability enables high-speed data processing and advanced signal processing functions.

Power Supplies (V): 5

Operating at 5V nominal supply voltage ensures compatibility with standard power sources and helps in reducing power consumption.

No. of Terminals: 196

Having 196 terminals allows for connectivity to various external components and peripherals, increasing the versatility of the DSP.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes the DSP suitable for industrial and automotive applications where extreme temperatures may be encountered.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures the DSP can operate reliably in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection to the PCB, reducing the risk of signal interference or discontinuity.

RAM Words: 2048

An extensive RAM capacity of 2048 words allows for efficient data storage and retrieval operations, enabling complex signal processing tasks.

Maximum Clock Frequency: 28 MHz

Operating at a maximum clock frequency of 28 MHz ensures high-speed processing capabilities and real-time signal processing.

External Data Bus Width: 32

With a wide external data bus width of 32 bits, the DSP can efficiently handle larger data sets and perform complex calculations with precision.

Technology: CMOS

The use of CMOS technology offers low power consumption, high reliability, and compatibility with various digital systems, making it a cost-effective choice.

Maximum Supply Current: 500 mA

The maximum supply current of 500mA ensures stable power delivery to the DSP, preventing voltage fluctuations and ensuring consistent performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and helps in reducing power consumption.

Format: FLOATING POINT

Support for floating-point format allows for precise numerical calculations and improved accuracy in signal processing applications.

Barrel Shifter: YES

The inclusion of a barrel shifter enhances the DSP's performance by enabling efficient data manipulation and shifting operations, improving processing speed.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30HFGM28 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

28 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F196

Length:

34.29 mm

Low Power Mode:

NO

No. of Terminals:

196

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

TPAK196,2.5SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

34.29 mm

Peripheral IC Type:

Trade Compliance

SM320C30HFGM28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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