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ADSP-TS201SABP-060

Analog Devices

ADSP-TS201SABP-060 by Analog Devices

ADSP-TS201SABP-060 by Analog Devices is a 32-bit DSP with max clock freq of 125MHz. It has 786432 RAM words, operates in -40 to 85 °C temp range, and supports boundary scan. Ideal for industrial applications requiring high-speed signal processing capabilities.

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Vyrian

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Digiode

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Chip Stock

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Nova Conductors

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Bristol Electronics

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Semicontronic

India . 683 parts In-Stock

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$5.850

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AZTECH Wire

Italy . 621 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 3,249 parts In-Stock

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Ampacity Inc.

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Parana Technologies

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

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Aztec Data Supply Inc.

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DigiPath Technology Company

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Overview

Elevate your digital signal processing capabilities with the ADSP-TS201SABP-060 by Analog Devices. Designed with precision and reliability in mind, this DSP exemplifies the high quality that Analog Devices is known for. With a wide range of applications in industries such as telecommunications, audio processing, and industrial automation, this DSP offers unmatched performance and efficiency. Experience the value of seamless integration, superior functionality, and cutting-edge technology that the ADSP-TS201SABP-060 brings to the table. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and reliability, making the product suitable for a wide range of applications.

Surface Mount:

YES - This feature allows for easy and convenient mounting on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

1.26 V - The high maximum supply voltage provides flexibility and compatibility with a variety of power sources.

Address Bus Width:

32 - The wide address bus width enables efficient data transfer and processing capabilities, enhancing performance.

Package Shape:

SQUARE - The square package shape helps optimize board space utilization and simplifies design layout.

Bit Size:

32 - The 32-bit size allows for high-speed processing of complex algorithms and tasks, ensuring fast and efficient operations.

Power Supplies (V):

1.2, 1.6, 2.5 - The multiple power supply options offer versatility and adaptability to different voltage requirements in various systems.

No. of Terminals:

576 - The large number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter):

GRID ARRAY - The grid array package style offers improved thermal performance and reliability, making it suitable for demanding applications.

Minimum Supply Voltage:

1.14 V - The low minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature:

85 °C - The high operating temperature range allows for reliable performance in harsh environments and industrial applications.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish:

TIN LEAD SILVER - The terminal finish provides excellent solderability and corrosion resistance, enhancing product longevity.

Terminal Position:

BOTTOM - The bottom terminal position facilitates easy and secure mounting on circuit boards, improving overall reliability.

Maximum Seated Height:

3.1 mm - The low seated height profile is ideal for compact designs and space-constrained applications.

RAM Words:

786432 - The large RAM capacity enables efficient data storage and retrieval during processing, enhancing overall system performance.

Width:

25 mm - The compact width dimension allows for easy integration into tight spaces and compact device designs.

Boundary Scan:

YES - The boundary scan feature enables easy and comprehensive testing and debugging of the product, ensuring high reliability and quality.

External Data Bus Width:

64 - The wide external data bus width allows for high-speed data transfer between the processor and external memory devices.

Maximum Clock Frequency:

125 MHz - The high maximum clock frequency ensures fast data processing and execution speed, making the product suitable for demanding applications.

Peak Reflow Temperature °C:

225 - The high peak reflow temperature tolerance ensures the product's reliability during manufacturing and assembly processes.

Internal Bus Architecture:

MULTIPLE - The multiple internal bus architecture design enhances data transfer efficiency, enabling optimal performance in multitasking scenarios.

Length:

25 mm - The compact length dimension enables easy integration into space-constrained designs, making it suitable for portable and compact devices.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade rating ensures reliable operation in rugged environments and industrial settings.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - The versatile peripheral IC type allows for integration with a variety of external devices and peripherals, enhancing product functionality and compatibility.

Technology:

CMOS - The CMOS technology offers low power consumption and high-speed operation, making the product energy-efficient and performance-oriented.

Terminal Form:

BALL - The ball terminal form provides secure and reliable connections for efficient data transmission and processing.

Nominal Supply Voltage:

1.2 V - The nominal supply voltage ensures stable and consistent power delivery for optimal performance and efficiency.

Terminal Pitch:

1 mm - The small terminal pitch spacing allows for high-density connections and compact design layouts, improving overall system integration.

Format:

FLOATING POINT - The floating-point format supports high-precision calculations and complex algorithms, making the product suitable for demanding computational tasks.

Moisture Sensitivity Level (MSL):

3 - The moderate moisture sensitivity level ensures the product's reliability and durability in varying environmental conditions.

Barrel Shifter:

YES - The barrel shifter feature enhances data processing efficiency and speed, making the product ideal for tasks requiring complex data manipulation.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-TS201SABP-060 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 2.5V SUPPLY

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

125 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B576

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

576

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA576,24X24,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

225

Power Supplies (V):

1.2,1.6,2.5

Qualification:

Not Qualified

RAM Words:

786432

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

ADSP-TS201SABP-060 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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