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DSPIC33EV256GM106-H/PT

Microchip Technology

DSPIC33EV256GM106-H/PT by Microchip Technology

DSPIC33EV256GM106-H/PT by Microchip is a 16-bit DSP with 262144 ROM words and 16384 RAM words. Ideal for automotive applications, it features 36-Ch 12-Bit ADC channels, 7 timers, and low power mode to operate at -40 to 150 °C temperature range.

Median Price

$5.310

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.310

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300

$5.310

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Vyrian

USA . 6,967 parts In-Stock

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6,967

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,288 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

$5.204

4,288

$5.310

-

-

$5.204

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$5.310

100+ parts

$5.044

1k+ parts

$4.792

10k+ parts

$4.726

120

$5.310

$5.044

$4.792

$4.726

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$6.039

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355

$6.039

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$6.160

100+ parts

$5.667

1k+ parts

$5.310

10k+ parts

-

100

$6.160

$5.667

$5.310

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Ampacity Inc.

Singapore . 807 parts In-Stock

1+ parts

$6.280

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807

$6.280

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Semicontronic

India . 672 parts In-Stock

1+ parts

$6.280

100+ parts

$6.123

1k+ parts

$6.092

10k+ parts

-

672

$6.280

$6.123

$6.092

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Corohmni

South Africa . 1,942 parts In-Stock

1+ parts

$57.174

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1,942

$57.174

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Aztec Data Supply Inc.

USA . 794 parts In-Stock

1+ parts

$78.080

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794

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Argo Parts USA

USA . 3,482 parts In-Stock

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3,482

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Marpe Global Electronics

Taiwan . 2,586 parts In-Stock

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2,586

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QualityLine Systems

Poland . 2,125 parts In-Stock

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2,125

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XL Components Corporation

Australia . 1,081 parts In-Stock

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1,081

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Overview

Elevate your digital signal processing game with the DSPIC33EV256GM106-H/PT by Microchip Technology. Crafted with precision and expertise, this cutting-edge digital signal processor offers unparalleled performance and reliability. Ideal for a wide range of applications, this product boasts a multitude of features that guarantee seamless integration and optimal functionality. Experience the power of innovation with Microchip Technology and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Enables easy and efficient integration onto printed circuit boards.

Maximum Supply Voltage: 5.5 V

Provides a wide voltage range for compatibility with various power sources.

On Chip Data RAM Width: 8

Allows for efficient data processing within the chip.

Screening Level: AEC-Q100; TS 16949

Meets automotive industry screening standards for reliability and quality assurance.

Package Shape: SQUARE

Facilitates easier placement and routing on PCBs.

Bit Size: 16

Offers high computational power for signal processing tasks.

Power Supplies (V): 5

Operates efficiently on a standard 5V power supply.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Enables space-saving and high-density PCB designs.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM106-H/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

36-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM106-H/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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